Embedded Pixel Package Layout for Uniform LED Light Emission
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Solution Overview
Problem
Conventional pixel packages with control chips block light emission from light-emitting diodes, leading to light pattern deviation and degraded image quality in display devices.
Innovation Solution
A pixel package design where the control chip is embedded within an embedded substrate, with light-emitting diodes on the surface and connected via a circuit structure, using a light-transmitting adhesive layer to maintain light transmission and even light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If the control chip is disposed on the circuit board surface, then the control function is achieved, but the light emission is blocked causing light pattern deviation
Solution Approach 1:
The control chip is embedded within a cavity formed in the circuit board, nesting the control component inside the substrate structure. This allows the control chip to perform its control function while being positioned below the light emission path, preventing light blocking and pattern deviation.
Solution Approach 2:
The control chip is repositioned from a surface-mounted configuration (2D plane) to an embedded configuration (3D depth). By moving the control chip into the thickness dimension of the circuit board, the light emission path in the horizontal plane is cleared, eliminating light blocking while maintaining control functionality.
2Reliability
If the control chip size is large, then the control function is achieved, but the light transmission is blocked
Solution Approach 1:
The large control chip is nested within an embedded cavity in the circuit board. This embedding allows the full-size control chip to be used for adequate control functionality while positioning it below the light emission path, ensuring light can transmit through the pixel package without being blocked by the control chip.
Solution Approach 2:
The control chip is relocated from the light transmission plane to a lower dimensional plane within the circuit board thickness. This vertical repositioning allows the control chip to maintain its required size for control functions while being out of the light path, preserving illumination intensity.
3Illumination intensity
If the control chip is embedded in the circuit board, then light transmission is improved, but the manufacturing complexity increases
Solution Approach 1:
The cavity for embedding the control chip is pre-formed in the circuit board during the circuit board manufacturing process, before the control chip and light-emitting components are assembled. This preliminary preparation of the embedding structure simplifies the overall manufacturing process by integrating the cavity formation into the existing circuit board fabrication workflow.
Solution Approach 2:
The control chip embedding process is merged with the circuit board assembly process. The cavity formation, control chip placement, and light-emitting component assembly are integrated into a unified manufacturing sequence, reducing the number of separate manufacturing steps and simplifying the overall process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded control chip design prevents light pattern deviation, enhancing image quality and providing a better viewing experience by ensuring uniform light emission.
Implementation Method 1
a light-transmitting adhesive layer covers the plurality of light-emitting semiconductor elements and is in direct contact with the base material
Data Source
AI summary
A pixel package includes a base material, a circuit structure, light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base material.