Embedded Planar Spiral Inductor for High-Frequency PCB
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Solution Overview
Problem
Current printed circuit boards face challenges in maintaining high magnetic permeability at high frequencies and achieving miniaturization while integrating inductor functions without increasing size or cost, and they lack the capability to incorporate both inductor and capacitor functions efficiently.
Innovation Solution
A multilayer printed circuit board design with a coil structure embedded in a magnetic substance, featuring a planar spiral coil pattern and a thin-film inductor structure without external electrodes, along with an integrated chip-type capacitor, which provides electrical connections through wiring vias, allowing for high magnetic permeability and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional inductor structure is used in a printed circuit board, then the inductor function is provided, but the magnetic permeability decreases at high frequencies and the size increases
Solution Approach 1:
The patent transitions from conventional three-dimensional inductor structures to a two-dimensional planar spiral coil pattern embedded within the multilayer PCB structure. This dimensional change allows the inductor to be integrated into the plane of the circuit board layers, reducing overall size while maintaining functionality through the magnetic core material positioned at the center of the spiral pattern.
Solution Approach 2:
The patent employs a composite structure consisting of a magnetic core material (ferrite or magnetic powder) combined with a planar spiral coil pattern. This composite design creates a thin-film inductor that achieves high magnetic permeability at high frequencies while minimizing the volume occupied by the inductor component within the PCB assembly.
2Adaptability or versatility
If external electrodes are added to accommodate the inductor, then the inductor function is provided, but the thickness and complexity increase
Solution Approach 1:
The patent merges the inductor structure with the existing PCB wiring layers and via structures. The planar spiral coil pattern is formed using the same conductive materials and processes as the PCB traces, and electrical connections are achieved through standard PCB vias that pass through the magnetic core material, eliminating the need for separate external electrodes and reducing structural complexity.
Solution Approach 2:
The PCB wiring layers and via structures serve dual functions: they provide the standard electrical interconnections required by the circuit board design while simultaneously forming the coil pattern and providing electrical connections for the inductor function. This multi-functionality eliminates the need for additional external electrodes and reduces overall device complexity.
3Length of moving object
If the PCB thickness is reduced for miniaturization, then the size is reduced, but the inductor and capacitor functions become difficult to integrate
Solution Approach 1:
The patent embeds the inductor structure within the multilayer PCB architecture, nesting the planar spiral coil pattern and magnetic core material between insulating layers. The capacitor is similarly integrated by positioning it adjacent to the inductor structure within the same layered assembly, allowing both components to share the reduced thickness while maintaining their functional integrity through the vertical stacking of functional layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the printed circuit board to maintain high magnetic permeability at high frequencies, reduce thickness, and integrate both inductor and capacitor functions at a low cost, improving inductor and capacitor performance by minimizing electrical paths and equivalent series inductance.
Implementation Method 1
a body including a magnetic substance
Data Source
AI summary
A printed circuit board includes a core layer having a first through-portion, a coil structure disposed in the first through-portion and comprising a support member, a first coil pattern in a planar spiral form disposed on one surface of the support member, and a body comprising a magnetic substance, wherein the support member and the first coil pattern are accommodated in the body, a first build-up layer covering at least a portion the core layer and disposed in at least a portion of the first through-portion, a first wiring layer disposed on one surface of the first build-up layer, and a first via layer passing through at least a portion of the first build-up layer and connected to the first wiring layer. The first via layer comprises a first wiring via connecting at least a portion of the first wiring layer to the first coil pattern.