Embedded Electronic Device Manufacturing with Polyurea Core Layer

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Solution Overview

Problem

Existing methods for manufacturing smart cards and similar devices often result in warping, voids, and limited functionality due to the use of thermosetting materials, which are not suitable for housing multiple electrical components and require custom equipment, limiting scalability and application scope.

Innovation Solution

The use of a printed circuit board with standoffs, overlays, and a core layer of thermosetting polymeric material, specifically polyurea, which is injected under cold, low-pressure conditions to encapsulate circuit components, ensuring rigidity and reducing internal stress points.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If thermosetting materials are used to encapsulate electronic components, then the material provides structural support and encapsulation, but the material causes warping, voids, and internal stress points

Engineering Contradiction:

Improvestructural supportVSAvoidwarping and voids

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent changes the temperature and pressure parameters during material injection and curing. By using lower temperatures and controlled pressure, the process reduces internal stress and prevents warping while maintaining structural integrity of the encapsulated device

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies release agents to the mold surfaces before injection and uses pre-heated tooling. These preliminary actions prevent void formation and ensure proper material flow, eliminating defects before they occur during the main encapsulation process

Inventive Principle:

Principle #10Preliminary action

2Reliability

If custom equipment is used for thermosetting material injection, then the process can handle thermosetting materials, but scalability and application scope are limited

Engineering Contradiction:

Improvematerial processing capabilityVSAvoidscalability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent modifies standard injection molding equipment to handle thermosetting materials. By making the equipment multi-functional, it can process both thermoplastic and thermosetting materials, thereby improving scalability and application scope without requiring completely custom-built equipment

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent divides the injection process into distinct stages with controlled parameters. This segmentation allows the equipment to be versatile - the same machine can be adjusted for different material types and product configurations, enhancing adaptability

Inventive Principle:

Principle #1Segmentation

3Quantity of substance

If electronic components are positioned in a void space between sheets, then the components can be encapsulated, but the process results in warping and limited functionality for multiple components

Engineering Contradiction:

Improvecomponent encapsulationVSAvoidwarping

Core Design Contradiction:

Quantity of substanceVSStability of the object's composition

Solution Approach 1:

The patent introduces a support structure as an intermediary element between the electronic components and the encapsulating material. This support structure provides a stable base that prevents warping while allowing multiple components to be properly positioned and encapsulated

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses a composite approach combining the support structure with the thermosetting material. This composite system provides both the structural stability needed to prevent warping and the encapsulation capability for multiple electronic components

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the cost-effective production of rigid, multi-component embedded electronic devices with reduced deformation and warping, enabling scalable manufacturing of smart cards and similar devices.

Implementation Method 1

a core layer of thermosetting polymeric material, specifically polyurea, which is injected under cold, low-pressure conditions to encapsulate circuit components

Methodology Applied

Scientific EffectInjection molding:

Implementation Method 2

thermosetting polymeric material, specifically polyurea, which is injected under cold, low-pressure conditions to encapsulate circuit components, ensuring rigidity

Methodology Applied

Scientific EffectPhase change: Phase Change

Data Source

PatentEP2042009B1An embedded electronic device and method for manufacturing an embedded electronic device

Publication Date: 2021.05.05 FITEQ INC

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AI summary

An embedded electronic device (1) and a method for manufacturing the same wherein the embedded electronic device (1) is composed of a printed circuit board (10), having a top surface (11) and a bottom surface (12), a plurality of circuit components (20) attached to the top surface (11) of the printed circuit board (10) having a plurality of standoffs (13) on the bottom surface (12) of the printed circuit board (10), a bottom overlay (30) attached to the bottom surface of the printed circuit board (10), a top overlay (40) positioned above the top surface of the printed circuit board (10) and a core layer (50) positioned between the top surface (11) of the printed circuit board (10) and the top overlay (40).