Embedded Power Device Module for Processor Substrate Voltage Conversion
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Solution Overview
Problem
Conventional processor substrates have low breakdown voltages, making them unable to handle high input voltages typically used in electronic systems, leading to significant I2R power losses due to high current requirements.
Innovation Solution
A processor substrate design featuring an electrically insulating material with embedded power device modules that convert intermediate voltages exceeding the substrate's voltage limit to a safe operating range for the processor, reducing current and power losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional processor substrates are used, then the substrate can be manufactured with low breakdown voltage materials, but the substrate cannot withstand high input voltages (e.g., 48V) and suffers from significant I2R power losses
Solution Approach 1:
The patent introduces an intermediary voltage conversion system consisting of a power converter on the circuit board and a power device module on the substrate. The power converter steps down the high input voltage (e.g., 48V) to an intermediate voltage (e.g., 5V), which is then further converted by the power device module to the processor operating voltage (e.g., 1.2V). This intermediary voltage conversion allows the substrate to operate at lower voltages while the circuit board handles high voltage power delivery, resolving the contradiction between energy loss reduction and voltage withstanding capability.
2Loss of energy
If high voltage is used for power delivery across the circuit board, then I2R power losses are reduced, but conventional processor substrates cannot tolerate the high voltage
Solution Approach 1:
The patent segments the voltage conversion function into two separate stages: (1) a power converter on the circuit board that converts high input voltage to an intermediate voltage, and (2) a power device module embedded in the substrate that converts the intermediate voltage to the processor operating voltage. This segmentation allows the circuit board to handle high voltage power delivery (reducing I2R losses) while the substrate only experiences lower intermediate and operating voltages (avoiding voltage breakdown).
Solution Approach 2:
The intermediate voltage serves as a mediator between the high voltage power delivery system on the circuit board and the low voltage processor on the substrate. By introducing this intermediate voltage level (e.g., 5V), the system can transmit power at high voltage across the board while protecting the substrate from excessive voltage through staged conversion.
3Loss of energy
If the substrate is designed to withstand high voltages, then power can be conveyed with higher voltage and lower current, but the substrate requires high breakdown voltage materials which increase device complexity
Solution Approach 1:
The voltage conversion functionality is segmented into separate dedicated components: a power converter on the circuit board and a power device module on the substrate. This segmentation allows each component to be optimized for its specific voltage range, avoiding the need for complex high-voltage substrate design while still enabling high-voltage power delivery on the board.
Solution Approach 2:
The patent moves the high voltage handling capability from the substrate dimension to the circuit board dimension by placing the power converter on the board and the power device module on the substrate. This dimensional redistribution allows the substrate to remain simple (using low breakdown voltage materials) while the system as a whole supports high voltage power delivery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for power delivery across the circuit board with higher voltages and lower currents, substantially reducing I2R power losses while using low breakdown voltage materials safely.
Implementation Method 1
a power device module embedded in the electrically insulating material and configured to convert the intermediate voltage at the second main side to a voltage that is within an operating range of the processor and below a voltage limit of the substrate
Data Source
AI summary
A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.