Embedded Power Electronics Assembly for Compact Heat Spreading
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power electronic devices, particularly those using silicon-carbide, face increased heat flux due to their compact footprint, necessitating improved cooling solutions while maintaining a compact package size.
Innovation Solution
The implementation of a power electronics assembly that includes a circuit board assembly with an S-cell structure, featuring a graphite layer and a metal layer encasing it, with a recess for the power electronics device, and thermally conductive vias to enhance heat spreading and cooling, bonded to a cold plate for efficient heat flux removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power electronic devices are made compact with smaller footprint, then device integration is improved, but heat flux increases
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat spreading by embedding the power electronic device within a laminate structure containing multiple conductive layers at different depths. Thermal vias connect these layers vertically, creating a multi-dimensional thermal conduction path that increases effective heat dissipation surface area while maintaining compact footprint.
Solution Approach 2:
The invention uses a composite laminate structure combining electrically insulating substrate material with embedded electrically conductive layers. This composite approach provides both electrical isolation and enhanced thermal conduction pathways, allowing compact device packaging while managing heat flux through the multi-layer composite structure.
2Temperature
If cooling requirements are increased for power electronic devices, then thermal management is improved, but package size increases
Solution Approach 1:
The patent merges the cooling function directly into the circuit board laminate structure by embedding conductive thermal management layers within the substrate itself. This integration eliminates the need for separate external cooling components, achieving improved cooling performance while maintaining compact package size.
Solution Approach 2:
The invention nests thermal management functionality within the existing laminate structure by embedding conductive layers inside the substrate layers. The power electronic device is embedded within recesses in the laminate, with thermal vias penetrating through multiple layers, creating a nested configuration that provides enhanced cooling without increasing overall package volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal conductivity and cooling performance by effectively directing heat flux from the power electronics devices to the cold plate, improving heat spreading and cooling efficiency within a compact package.
Implementation Method 1
an S-cell including: a graphite layer; and a metal layer encasing the graphite layer... one or more electrically conductive layers provided within the electrically insulating substrate... thermally coupling each of the power electronics devices to the one or more electrically conductive layers
Implementation Method 2
a cold plate, the metal layer of each S-cell bonded to the circuit board assembly is bonded to a first surface of the cold plate via the first electrically insulating layer... efficiently directing heat flux from the power electronics devices to the cold plate
Data Source
AI summary
A power electronics assembly includes a circuit board assembly including a first electrically insulating layer, an electrically insulating substrate, a laminate panel provided between the first electrically insulating layer and the electrically insulating substrate, and one or more electrically conductive layers provided within the electrically insulating substrate. The laminate panel includes a power electronics device assembly including an S-cell and a power electronics device. The S-cell includes a graphite layer and a metal layer encasing the graphite layer. A recess is formed in an outer surface of the metal layer and the power electronics device is disposed within the recess of the outer surface of the S-cell.