Embedded Magnetic Power Module Layout for Dense Thermal Design
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Solution Overview
Problem
Current power modules face limitations in achieving high efficiency, high power density, and high heat dissipation capacity, as individual optimization of components has reached its limits, making it difficult to further improve these aspects.
Innovation Solution
A power module design that embeds a magnetic component and conductive components between the wiring layers of a board, allowing for optimized integration and connection of power devices, enhancing flexibility and reducing occupied space, while also simplifying manufacturing and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual components are optimized separately, then each component reaches its performance limit, but the overall power module cannot achieve high efficiency, high power density, and high heat dissipation capacity simultaneously
Solution Approach 1:
The patent merges magnetic components, conductive components, and power devices into a single integrated power module structure. The magnetic component and conductive component are embedded together in the board, forming a unified assembly that achieves high efficiency, high power density, and high heat dissipation capacity simultaneously, rather than optimizing components separately.
Solution Approach 2:
The integrated power module structure serves multiple functions simultaneously: the magnetic component provides magnetic field generation, the conductive component provides electrical connection, and the embedded arrangement provides both compact integration and heat dissipation pathways. This multi-functional integration resolves the contradiction by making the system adaptable to different performance requirements.
2Volume of moving object
If power devices are closely integrated to increase power density, then occupied space is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent embeds the magnetic component and conductive component within the board structure, nesting multiple functional elements in a compact arrangement. The magnetic component is positioned between wiring layers, and the conductive component is integrated into the same structure, creating a nested configuration that reduces occupied space while maintaining manufacturability through systematic integration.
Solution Approach 2:
The magnetic component and conductive component are pre-integrated into the board structure during manufacturing, rather than being assembled separately after board fabrication. This preliminary integration action simplifies the overall manufacturing process by combining multiple steps into a unified production flow, reducing the complexity that would otherwise arise from close integration.
3Reliability
If magnetic components and conductive components are embedded in the board, then connection optimization and integration are achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent combines the magnetic component and conductive component into a single embedded assembly within the board. This merging of components into one integrated unit simplifies the manufacturing process by reducing the number of separate assembly steps, while still achieving optimized connections between magnetic and conductive elements for high performance.
4Loss of energy
If switching power supplies are used to improve conversion efficiency, then power loss is reduced, but circuit complexity and component count increase
Solution Approach 1:
The patent merges the magnetic component, conductive component, and power devices into an integrated switching power supply module. This consolidation achieves high conversion efficiency and reduced power loss while minimizing circuit complexity by integrating multiple functions into a unified structure, rather than using separate discrete components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high efficiency, high power density, and high heat dissipation capacity, reducing the occupied space on the system motherboard and improving design variability, making the power module more competitive.
Implementation Method 1
the magnetic component is disposed between the first side and the second side of the first board and includes at least one magnetic core and at least one winding
Implementation Method 2
the at least one conductive component is disposed between the first side and the second side
Data Source
AI summary
A power module and a manufacturing method thereof are disclosed. The power module includes a first board, a magnetic component, a second board and a power device. The first board includes a conductive component disposed between a first side and a second side opposite to each other. The magnetic component is disposed between the first side and the second side and includes a magnetic core and a winding. A first conductive terminal and a second conductive terminal are led out on the first side and the second side, respectively. The second board is disposed on the first board and includes a third side and a fourth side opposite to each other. The fourth side faces the first side. The power device is disposed on the third side of the second board and electrically connected to the first board.