Embedded Power Module PCB Core with Copper Traces
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Solution Overview
Problem
Current power modules with high-current connections face issues of high thermal resistance, self-inductance leading to power losses and material fatigue, especially in high-power DC/AC converters for electric vehicles, due to complex routing and detachment of aluminum wires.
Innovation Solution
A power module design featuring a printed circuit board core with conductive layers on both sides, using copper for thermal conductivity, and a metallic intermediate layer for connecting power components directly to heat dissipation plates via through-contacts, reducing self-inductance and enhancing thermal and electrical resilience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aluminum wires are used to connect power components, then electrical connections can be established, but the wires become detached due to high thermal expansion coefficient or tearing at bends
Solution Approach 1:
The patent removes the aluminum wire connection element from the system and replaces it with a direct copper trace connection on the PCB substrate. This extraction of the problematic wire bonding process eliminates the thermal expansion mismatch and mechanical stress issues that caused wire detachment and heel cracks.
Solution Approach 2:
The patent introduces a copper trace intermediary layer on the PCB substrate that provides a stable, thermally compatible connection path between power components. This copper trace acts as an intermediary that eliminates the need for aluminum wires while maintaining electrical connectivity and improving mechanical reliability.
2Reliability
If complex routing of connection lines is used to meet electrical and thermal requirements, then power components can be connected, but the device complexity increases
Solution Approach 1:
The PCB substrate serves multiple functions simultaneously: it provides electrical connection through copper traces, thermal management through its ground plane structure, mechanical support for power components, and structural integration for the entire power module. This multi-functionality eliminates the need for separate complex routing solutions.
Solution Approach 2:
The patent merges the electrical connection function and thermal management function into a single integrated PCB substrate structure. The copper traces and ground planes simultaneously conduct electricity and dissipate heat, eliminating the need for separate complex routing systems for electrical and thermal requirements.
3Temperature
If thick aluminum plates are used for heat dissipation, then thermal conductivity is improved, but the weight of the module increases
Solution Approach 1:
The patent uses a composite PCB substrate structure combining copper (high thermal and electrical conductivity) with fiberglass or other polymer materials. This composite structure provides excellent heat dissipation through the copper layers and ground planes while being significantly lighter than solid aluminum plates, achieving optimal thermal management with reduced weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation and reduced weight, allowing for high-current processing with low self-inductance, thus minimizing power losses and improving reliability in electric vehicle applications.
Implementation Method 1
each heat dissipation plate having a metallic outer layer and one of these covered by a heat-conducting, electrically insulating intermediate layer
Implementation Method 2
conductive layers on both sides, using copper for thermal conductivity, and a metallic intermediate layer for connecting power components directly to heat dissipation plates via through-contacts
Data Source
Figure 1
Figure 2~4
Figure 5a~5d
AI summary
A power module having a printed circuit board core (1) that contains at least one electronic power component (7) embedded in an insulating layer (4), the core being arranged between two heat dissipation plates (2, 3), wherein each heat dissipation plate has a metal exterior layer (2a, 3a) and a metal interior layer (2i, 3i) that is electrically isolated from the latter by a thermally conductive, electrically insulating intermediate layer (2z, 3z), and electrode connections of the at least one power component are guided out of the core via connecting lines, wherein the printed circuit board core (1) has a conductor layer (5, 6) on both sides of the insulating layer (4), at least one conductor layer (5) is structured at least in sections and each conductor layer (5, 6) is connected, at least in sections, to a metal interior layer (2i, 3i) of the heat dissipation plate (2, 3) via a conductive, metal intermediate ply (16o, 16u), contacts (11) run from the structured conductor layer to the electrode connections of the at least one power component (7), and at least one power connection (7s) of the at least one power component (7) is connected to at least one section of the metal interior layer (2i) of the heat dissipation plate, which forms part of the connecting line to the electrode connection, via a contact (11), a section of a structured conductor layer (5) and the conductive, metal intermediate ply (16o).