Embedded Inductor-Capacitor Power Module for PCB Space Saving
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Solution Overview
Problem
Power modules face challenges in conserving board space due to the large footprint of output capacitors, which limits the number of power converters and the power that can be delivered to devices like GPUs and CPUs, especially in applications with fixed board form factors.
Innovation Solution
The integration of output capacitors within a substrate layer of a printed circuit board (PCB) instead of on its surface, combined with embedded output inductors, allows for a low-profile power module design that reduces physical size while maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If output capacitors are placed on the surface of the PCB, then they provide necessary power delivery function, but they occupy large board space and limit the number of power converters
Solution Approach 1:
The patent embeds output capacitors and inductors within the substrate layers of the PCB rather than placing them on the surface. This transitions the component placement from two-dimensional surface mounting to three-dimensional internal embedding, utilizing the vertical dimension of the PCB structure to accommodate power delivery components without increasing the board footprint.
Solution Approach 2:
The patent integrates multiple power delivery components (capacitors and inductors) within the same substrate layers, nesting them together in a compact arrangement. This allows capacitors and inductors to share the same spatial envelope within the PCB structure, reducing the total space required compared to surface mounting where components would be distributed across the board surface.
2Power
If more power converters are added to increase power delivery, then power capability improves, but board space consumption increases
Solution Approach 1:
The patent combines multiple power converter phases by embedding their associated capacitors and inductors within the same substrate layers. This merging approach allows multiple power delivery functions to be integrated into a compact shared structure, enabling higher total power delivery capability without proportionally increasing the board space footprint.
Solution Approach 2:
By moving power delivery components into the third dimension (within substrate layers), the patent enables higher component density. This allows multiple power converters to be accommodated in a compact footprint by utilizing the vertical space within the PCB structure rather than spreading components across the board surface.
3Area of stationary object
If a low-profile design is implemented by embedding components, then board space is conserved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the PCB into multiple substrate layers, with power delivery components (capacitors and inductors) embedded in specific internal layers while other layers handle signal routing and component mounting. This segmentation allows the manufacturing process to be broken into manageable stages, reducing overall complexity despite the advanced embedding technique.
Solution Approach 2:
The substrate layers serve multiple functions: they provide mechanical support for the PCB, act as mounting structures for embedded capacitors and inductors, and provide electrical interconnects between components. This multi-functionality reduces the need for separate dedicated structures, simplifying the overall manufacturing process despite the low-profile design requirements.
Data Source
AI summary
A power module includes a substrate and an integrated circuit (IC) die. The IC die is disposed on the substrate. A driver and a pair of switches are integrated in the IC die. A power converter of the power module includes the driver, the pair of switches, an inductor, and a capacitor. The inductor and the capacitor are embedded within the substrate.