Embedded Power PCB Assembly With CVD Dielectric Cooling

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Solution Overview

Problem

The design, manufacture, and cooling of multi-layer PCBs with embedded power devices pose challenges due to their complexity and thermal management requirements.

Innovation Solution

A power device embedded printed circuit board assembly that includes a cold plate bonded to a multi-layer PCB with a chemical vapor deposition (CVD) dielectric layer and a bonding layer for enhanced thermal communication, providing electrical insulation and improved heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional insulation methods are used between cold plate and PCB, then electrical insulation is provided, but thermal communication is insufficient leading to higher operating temperatures

Engineering Contradiction:

Improvepower device operating temperatureVSAvoidthermal management effectiveness

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

A thin film dielectric layer is introduced as an intermediary between the cold plate and PCB. This dielectric layer provides electrical insulation while maintaining thermal communication through its high thermal conductivity, resolving the contradiction between electrical isolation and thermal management

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding interface uses a composite structure combining dielectric material with high thermal conductivity properties. This composite approach allows simultaneous achievement of electrical insulation and effective heat transfer, reducing power device temperatures by up to 42°C

Inventive Principle:

Principle #40Composite materials

2Quantity of substance

If multi-layer PCBs with embedded power devices are used, then higher component capacity and density are achieved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectronic component densityVSAvoidPCB structure complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The cold plate is merged with the PCB structure through direct bonding at the PCB substrate level. This integration combines thermal management functionality with the mechanical support structure, enabling embedded power devices while simplifying the overall assembly process

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention moves thermal management to the substrate level (another dimension) rather than using traditional top-level heat sinks. This dimensional shift allows for better heat extraction from embedded power devices while maintaining a compact form factor

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Quantity of substance

If multi-layer PCBs with embedded power devices are used, then higher component capacity is achieved, but cooling difficulty increases

Engineering Contradiction:

Improveelectronic component capacityVSAvoidcooling system implementation

Core Design Contradiction:

Quantity of substanceVSEase of manufacture

Solution Approach 1:

The cold plate is bonded to the PCB substrate before power devices are mounted and wired. This preliminary action simplifies subsequent assembly steps and enables effective cooling of embedded devices without complicating the manufacturing process

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The assembly effectively maintains power device temperatures below predefined levels through efficient heat extraction, outperforming traditional insulation methods by reducing maximum operating temperatures by up to 42°C.

Implementation Method 1

a chemical vapor deposition (CVD) dielectric layer disposed between the cold plate and the multi-layer PCB

Methodology Applied

Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 2

a bonding layer disposed between the CVD dielectric layer and the multi-layer PCB

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12387994B2Power device embedded printed circuit board assemblies with thin film dielectric layers

Publication Date: 2025.08.12 MIRISE TECH CORP

AI summary

A power device embedded printed circuit board (PCB) assembly includes a cold plate, a multi-layer PCB with at least one power device embedded therein bonded to and in thermal communication with the cold plate, and a chemical vapor deposition (CVD) dielectric layer disposed between the cold plate and the multi-layer PCB. The CVD dielectric layer can be applied to the cold plate and a bonding layer can be sandwiched between the CVD dielectric layer and the multi-layer PCB with at least one power device assembly embedded therein. In the alternative, CVD dielectric layer can be applied top the multi-layer PCB with at least one power device assembly embedded therein and bonding layer can be sandwiched between the CVD dielectric layer and the cold plate.