Embedded Power Regulator Packaging for Shorter Power Paths
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Solution Overview
Problem
The integration of power regulating components with electronic components in electronic devices is affected by the distance of the power transmission path, impacting device performance.
Innovation Solution
The implementation of a power regulating component embedded within encapsulants, with terminals connected to a redistribution layer, allowing for a shorter power transmission path and increased terminal density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power regulating component is integrated with the electronic component, then the device performance is improved, but the power transmission path distance increases causing power loss
Solution Approach 1:
The power regulating component is positioned underneath the electronic component in a vertical arrangement, utilizing the Z-axis dimension rather than lateral placement. This dimensional change shortens the power transmission path while maintaining integration, thereby reducing power loss without compromising device performance.
Solution Approach 2:
The power regulating component is embedded within the encapsulant structure that also houses the electronic component, creating a nested configuration. This nesting approach enables close proximity between power source and electronic component, minimizing transmission distance and power loss while achieving effective integration.
2Loss of energy
If the power regulating component is positioned closer to the electronic component, then power loss is reduced, but the terminal density decreases
Solution Approach 1:
By transitioning from a lateral to a vertical power transmission arrangement, the design accommodates multiple terminals in the vertical dimension. This allows closer positioning of the power regulating component while maintaining high terminal density through stacked or vertically arranged connection points.
Solution Approach 2:
The power regulating component is designed with multiple segmented terminals that can be vertically stacked or distributed along the vertical axis. This segmentation enables close proximity to the electronic component while preserving high terminal density through multiple discrete connection points arranged in the vertical dimension.
Data Source
AI summary
An electronic device is provided. The electronic device includes an electronic component, a first encapsulant, a second encapsulant, and a first power regulating component. The encapsulant has an active surface and a backside surface configured to receive a first power. The first encapsulant at least partially encapsulates the electronic component. The second encapsulant is disposed under the first encapsulant. The first power regulating component is configured to transmit the first power to the electronic component and at least partially embedded within the second encapsulant.