Embedded Power Semiconductor Carrier Thermal Stress Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component packaging methods fail to efficiently embed power semiconductor devices within circuit boards while ensuring proper electrical and mechanical connections, leading to potential stress from thermal expansion coefficients and limited flexibility in component replacement.
Innovation Solution
A system comprising an electronic component with a power semiconductor device embedded in a dielectric core layer, a first carrier with contact pads for surface mounting, and a second carrier that covers the component, allowing it to be positioned within a circuit board aperture with the first carrier attached to the board, enabling electrical coupling and reducing direct contact with the board material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power semiconductor devices are directly embedded in circuit board material, then electrical connections are achieved, but thermal expansion stress increases due to material incompatibility
Solution Approach 1:
The patent introduces carrier members (first and second carriers) as intermediary components between the power semiconductor device and the circuit board. These carriers have apertures that receive the semiconductor device and provide a transition interface, mediating the thermal expansion differences between the semiconductor device and the circuit board material to reduce stress while maintaining electrical connections.
Solution Approach 2:
The patent employs composite material structures where the carrier members combine different materials with compatible thermal expansion properties. The carriers are constructed to bridge the thermal expansion coefficient mismatch between the power semiconductor device and the circuit board, creating a composite assembly that reduces thermal stress while ensuring reliable electrical connections.
2Reliability
If power semiconductor devices are directly mounted on circuit boards, then electrical connections are established, but component replacement flexibility is reduced
Solution Approach 1:
The patent divides the mounting system into separate modular components: first carriers, second carriers, and power semiconductor devices. This segmentation allows the semiconductor device to be independently removed and replaced by manipulating the carrier members, which can be detached from the circuit board, thereby improving repair flexibility while maintaining reliable electrical connections during operation.
3Volume of moving object
If power semiconductor devices are embedded in circuit boards, then space utilization is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary action by pre-assembling the power semiconductor devices onto the carrier members before mounting them onto the circuit board. The carriers are prepared with apertures and contact structures in advance, allowing the semiconductor devices to be positioned and secured beforehand. This preliminary assembly simplifies the final embedding process and reduces overall manufacturing complexity while achieving compact space utilization.
Data Source
AI summary
In an embodiment, a method includes arranging a first carrier on a first major surface of a circuit board such that an electronic component arranged on the first carrier is positioned in an aperture in the circuit board and spaced apart from side walls of the aperture, and arranging a second carrier on a second major surface of the circuit board such that the second carrier covers the electronic component and the aperture, the second major surface of the circuit board opposing the first major surface of the circuit board. The electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact pad arranged on a first major surface of the dielectric core layer.