Embedded Pressure Sensor Cavity for Internal Structural Monitoring
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Solution Overview
Problem
Conventional electronic monitoring devices for structural health monitoring in load-bearing structures are limited in detecting internal parameters and cannot be applied during construction, missing initial defects and providing incomplete data on structural quality and safety.
Innovation Solution
A pressure sensing device with a body configured to distribute load between parts, featuring an integrated circuit die with pressure sensing circuitry and an IC interface, including a transceiver circuit and electrically conductive antenna traces, which can be mounted with a support body and encapsulation material to measure bending and pressure, allowing for internal defect detection and continuous monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electronic monitoring devices are applied onto the surface of structures or inside accessible recesses, then the devices can be installed after construction, but they are unable to detect internal parameters and miss initial defects within the structure
Solution Approach 1:
The pressure sensing device is designed to be embedded within the structure during construction rather than installed afterward. The device includes a body with pressure sensing circuitry that can be positioned in cavities or recesses formed during the construction process, enabling detection of internal parameters and initial defects before the structure is complete. This preliminary placement allows comprehensive monitoring from the outset.
2Ease of operation
If monitoring devices are installed after construction, then installation is simple and accessible, but comprehensive internal parameter detection is not achieved
Solution Approach 1:
The pressure sensing device is designed to be nested within the structure's construction elements. The device body can be placed in cavities within concrete elements, between structural components, or integrated into formwork during construction. This nesting approach allows the device to be surrounded by structural material while remaining functional, achieving both embedded positioning and comprehensive internal monitoring.
3Loss of information
If pressure sensing circuitry is embedded within the structure during construction, then internal defect detection is enabled, but the device complexity increases
Solution Approach 1:
The pressure sensing device is designed with multi-functionality to reduce overall system complexity. The single device integrates pressure sensing circuitry, wireless communication capabilities, and power management functions. The body can serve multiple purposes: structural reinforcement, sensor housing, and signal transmission medium. This consolidation of functions into a single integrated device reduces the number of separate components needed.
4Measurement precision
If the IC die defines a cavity with the support body, then pressure sensing responsiveness to bending is improved, but manufacturing precision requirements increase
Solution Approach 1:
The cavity dimensions and characteristics are designed as adjustable parameters rather than fixed geometric features. The cavity size, shape, and position relative to the IC die can be varied to optimize pressure sensing performance for different applications. By treating cavity parameters as design variables rather than precision constraints, the system achieves high measurement sensitivity without requiring extremely tight manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables comprehensive monitoring of structural parameters, including pressure and mechanical stresses, both during and after construction, enhancing the evaluation of structural quality and safety by providing continuous and accurate data on internal conditions.
Implementation Method 1
The IC die may include pressure sensing circuitry responsive to bending associated with the cavity
Data Source
AI summary
A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.