Embedded Processor Self-Testing Logic Chip Power Management
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Solution Overview
Problem
The increasing complexity and power consumption of electronic devices due to enhanced processor speeds and capacities lead to challenges in managing power depletion, operational costs, and performance degradation, particularly related to heating and current flow effects.
Innovation Solution
Incorporating a logic chip with a pattern buffer and an embedded processor that enables self-testing and self-healing of electronic device structures, allowing for autonomous testing, calibration, and repair by generating and processing test patterns in bursts, thereby managing device health and reducing external hardware dependency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If processor speed and capacity are enhanced to increase device functionality, then device capacity and functionality are improved, but power consumption increases
Solution Approach 1:
The embedded processor enables the electronic device structure to perform self-testing and self-healing operations autonomously. The pattern buffer stores test patterns that are applied to the electronic device structure, and the embedded processor analyzes results and performs repairs without external intervention, allowing the system to maintain itself and reducing the need for external testing equipment.
Solution Approach 2:
The embedded processor serves multiple functions: it controls the pattern buffer, generates test patterns, analyzes test results, and performs repair operations. This multi-functional approach consolidates what would traditionally require separate dedicated testing and repair hardware into a single versatile processor, reducing overall system complexity and power consumption.
2Productivity
If processor speed and capacity are enhanced to increase device functionality, then device capacity and functionality are improved, but operational costs increase
Solution Approach 1:
The self-healing capability allows the electronic device structure to automatically repair defects without external intervention. The embedded processor identifies defects through self-testing and activates repair mechanisms, eliminating the need for manual repair operations and reducing operational costs associated with maintenance and repairs.
3Productivity
If processor speed and capacity are enhanced to increase device functionality, then device capacity and functionality are improved, but performance degradation occurs due to heating and current flow effects
Solution Approach 1:
The self-testing mechanism provides continuous feedback about the health and performance of the electronic device structure. The embedded processor monitors for defects and performance degradation, allowing early detection and correction of issues before they lead to complete failure, thus maintaining reliability despite increased processing speeds and associated thermal effects.
4Ease of operation
If self-testing and self-healing capabilities are added to enable autonomous operation, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The pattern buffer and embedded processor are integrated into a unified self-testing and self-healing system. The pattern buffer stores test patterns, the embedded processor controls the testing operation and analyzes results, and repair mechanisms are activated automatically. This merging of functions into a cohesive system achieves autonomous operation while managing complexity through integration rather than separate independent components.
Data Source
AI summary
Electronic apparatus, systems, and methods of operating and constructing the electronic apparatus and/or systems include an embedded processor disposed in a logic chip to direct, among other functions, self-testing of an electronic device structure in conjunction with a pattern buffer disposed in the logic chip, when the electronic device structure is coupled to the logic chip. Additional apparatus, systems, and methods are disclosed.