Embedded Pumping in Liquid-Cooled Heat Dissipation Device
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Solution Overview
Problem
Conventional liquid-cooled heat dissipation devices occupy large spaces and have limited installation flexibility due to the separate and external connection of pumping and heat dissipation components, making them unsuitable for conventional environments.
Innovation Solution
An integrated liquid-cooled heat dissipation device with a pumping device embedded within a water chamber, reducing the overall thickness and space occupancy while maintaining effective heat exchange through a compact design that includes a water pump base, shell, impeller, and partitioned water chambers with cooling tubes and heat dissipation structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the pumping device and heat dissipation device are externally connected to form a closed liquid circulation loop, then the liquid circulation function is achieved, but the device occupies large space and has poor installation flexibility
Solution Approach 1:
The patent merges the pumping device and heat dissipation device into a single integrated unit. The pumping device is embedded within the heat dissipation device, with the water pump base, shell, and impeller forming a compact assembly that is directly integrated into the heat dissipation structure. This eliminates the need for external connection pipes and separate mounting, thereby reducing space occupation and improving installation flexibility.
Solution Approach 2:
The patent applies nesting by placing the pumping device inside the heat dissipation device. The water pump base is embedded in the first water chamber, the water pump shell is positioned within the receiving cavity, and the impeller is received in the water pump water chamber. This nested arrangement allows the pumping function to be housed within the heat dissipation structure, significantly reducing the overall device footprint.
2Loss of energy
If the pumping device is externally connected to the heat dissipation device, then the liquid circulation loop is formed, but the circulation distance of liquid is long and power attenuation is high
Solution Approach 1:
By merging the pumping device and heat dissipation device into a single integrated unit, the liquid circulation path is dramatically shortened. The liquid flows directly from the heat dissipation structure through the embedded pumping device without requiring long external connection pipes, thereby reducing power attenuation and energy loss in the pumping process.
3Adaptability or versatility
If conventional water-cooled heat sinks are used, then heat dissipation function is achieved, but the design has high requirements for installation space and is inconvenient for installation and operation
Solution Approach 1:
The patent combines the pumping device and heat dissipation device into an integrated unit, creating a compact design that maintains effective heat dissipation functionality while significantly reducing the overall device size. This integrated design enables the device to adapt to conventional installation environments where space is limited, thereby expanding the application range and improving versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design reduces space requirements, minimizes power loss in the pumping device, and enhances heat exchange efficiency, making it more applicable in conventional environments.
Implementation Method 1
the impeller is received in the water pump water chamber
Implementation Method 2
each cooling tube is arranged between adjacent heat dissipation structure devices; and each of the plurality of cooling tubes has one end in communication with a fourth water chamber, some of the cooling tubes have the other end in communication with the first water chamber
Implementation Method 3
the heat dissipation device further includes a fourth water chamber, a plurality of cooling tubes and a plurality of heat dissipation structure devices
Data Source
AI summary
The present invention relates to the technical field of liquid-cooled heat dissipation, and in particular to an integrated liquid-cooled heat dissipation device. The heat dissipation device includes a first water chamber, a pumping device and a first interface. The first interface is mounted on one side of the first water chamber. The pumping device is provided in an embedded manner in the first water chamber, and the pumping device includes a water pump water chamber which is in communication with the first interface and an interior of the first water chamber. An objective of the present invention is to provide an integrated liquid-cooled heat dissipation device, which, through the rational design of a pumping device and a heat dissipation device, solves the problem that the integrated pumping and dissipation structure cannot meet the general space requirements.


