Embedded Pumping in Liquid-Cooled Heat Dissipation Device

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Solution Overview

Problem

Conventional liquid-cooled heat dissipation devices occupy large spaces and have limited installation flexibility due to the separate and external connection of pumping and heat dissipation components, making them unsuitable for conventional environments.

Innovation Solution

An integrated liquid-cooled heat dissipation device with a pumping device embedded within a water chamber, reducing the overall thickness and space occupancy while maintaining effective heat exchange through a compact design that includes a water pump base, shell, impeller, and partitioned water chambers with cooling tubes and heat dissipation structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the pumping device and heat dissipation device are externally connected to form a closed liquid circulation loop, then the liquid circulation function is achieved, but the device occupies large space and has poor installation flexibility

Engineering Contradiction:
Improveinstallation flexibilityVSAvoiddevice space occupation
Core Design Contradiction:
Ease of operationVSVolume of stationary object

Solution Approach 1:

The patent merges the pumping device and heat dissipation device into a single integrated unit. The pumping device is embedded within the heat dissipation device, with the water pump base, shell, and impeller forming a compact assembly that is directly integrated into the heat dissipation structure. This eliminates the need for external connection pipes and separate mounting, thereby reducing space occupation and improving installation flexibility.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent applies nesting by placing the pumping device inside the heat dissipation device. The water pump base is embedded in the first water chamber, the water pump shell is positioned within the receiving cavity, and the impeller is received in the water pump water chamber. This nested arrangement allows the pumping function to be housed within the heat dissipation structure, significantly reducing the overall device footprint.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Loss of energy

If the pumping device is externally connected to the heat dissipation device, then the liquid circulation loop is formed, but the circulation distance of liquid is long and power attenuation is high

Engineering Contradiction:
Improvepumping device power attenuationVSAvoidliquid circulation path
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

By merging the pumping device and heat dissipation device into a single integrated unit, the liquid circulation path is dramatically shortened. The liquid flows directly from the heat dissipation structure through the embedded pumping device without requiring long external connection pipes, thereby reducing power attenuation and energy loss in the pumping process.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If conventional water-cooled heat sinks are used, then heat dissipation function is achieved, but the design has high requirements for installation space and is inconvenient for installation and operation

Engineering Contradiction:
Improveapplication rangeVSAvoidheat dissipation device size
Core Design Contradiction:
Adaptability or versatilityVSVolume of stationary object

Solution Approach 1:

The patent combines the pumping device and heat dissipation device into an integrated unit, creating a compact design that maintains effective heat dissipation functionality while significantly reducing the overall device size. This integrated design enables the device to adapt to conventional installation environments where space is limited, thereby expanding the application range and improving versatility.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated design reduces space requirements, minimizes power loss in the pumping device, and enhances heat exchange efficiency, making it more applicable in conventional environments.

Implementation Method 1

the impeller is received in the water pump water chamber

Methodology Applied
Scientific EffectImpeller rotation: Impeller

Implementation Method 2

each cooling tube is arranged between adjacent heat dissipation structure devices; and each of the plurality of cooling tubes has one end in communication with a fourth water chamber, some of the cooling tubes have the other end in communication with the first water chamber

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 3

the heat dissipation device further includes a fourth water chamber, a plurality of cooling tubes and a plurality of heat dissipation structure devices

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS20230232579A1Integrated liquid-cooled heat dissipation device
Publication Date: 2023.07.20 DONGGUAN CITY THINK-COOL THERMAL DISSIPATION TECH CO LTD
  • US20230232579A1 patent drawing
  • US20230232579A1 patent drawing
  • US20230232579A1 patent drawing

AI summary

The present invention relates to the technical field of liquid-cooled heat dissipation, and in particular to an integrated liquid-cooled heat dissipation device. The heat dissipation device includes a first water chamber, a pumping device and a first interface. The first interface is mounted on one side of the first water chamber. The pumping device is provided in an embedded manner in the first water chamber, and the pumping device includes a water pump water chamber which is in communication with the first interface and an interior of the first water chamber. An objective of the present invention is to provide an integrated liquid-cooled heat dissipation device, which, through the rational design of a pumping device and a heat dissipation device, solves the problem that the integrated pumping and dissipation structure cannot meet the general space requirements.