Semiconductor device and manufacturing method thereof
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Solution Overview
Problem
Conventional power regulation solutions for microelectronics suffer from significant power losses, large footprint, complex design, poor system power efficiency, inadequate response time, and lower accuracy due to the distance between power converters and processors, leading to increased energy consumption and electromagnetic interference (EMI).
Innovation Solution
The integration of embedded and grounded Faraday caged or shielded voltage regulator structures within a fine-line/space package substrate reduces the distance between power conversion circuits and processors, enhancing system energy efficiency and reducing EMI susceptibility by embedding voltage regulators and sub-circuitries close to the processor, thereby minimizing thermal conduction losses and dynamic power consumption variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power converters are mounted on a printed circuit board at a large distance away from the processor, then the design is easier to implement with discrete components, but power losses increase due to thermal conduction loss and large AC impedance
Solution Approach 1:
The patent merges the power converter components (inductor, capacitor, switch) and processor onto a single integrated circuit substrate, eliminating the separate printed circuit board mounting. This integration reduces the distance between components, minimizing thermal conduction loss and AC impedance while maintaining manufacturability through standardized substrate fabrication processes
Solution Approach 2:
The patent embeds discrete power converter components (inductor, capacitor, switch) within recesses of the substrate, nesting them inside the substrate structure. This nesting approach reduces the overall footprint and distance between components compared to surface mounting, thereby reducing power losses while keeping the design relatively simple
2Ease of manufacture
If power converters are mounted at a large distance from the processor, then component placement is simpler, but the footprint increases and system power efficiency deteriorates
Solution Approach 1:
By merging all power converter components and the processor onto a single substrate, the patent eliminates the need for separate mounting areas on different boards. This consolidation dramatically reduces the overall footprint while the standardized substrate fabrication processes maintain ease of manufacture
Solution Approach 2:
The patent nests power converter components within substrate recesses, allowing them to be embedded rather than surface-mounted. This nesting approach significantly reduces the footprint by utilizing the substrate's internal volume and vertical space, while the recess formation and component placement remain relatively simple
3Device complexity
If power converters are located far from the processor, then the design is less complex, but response time becomes inadequate and accuracy decreases
Solution Approach 1:
The patent merges the power converter and processor onto the same substrate, minimizing the physical distance between components. This reduction in distance directly improves response time by reducing signal propagation delays and electromagnetic interference, while the integrated design maintains manageable complexity through standardized fabrication processes
Solution Approach 2:
By nesting power converter components within the substrate near the processor, the patent reduces the distance between components without adding significant design complexity. The embedding process follows standard substrate fabrication techniques, maintaining relative simplicity while achieving faster response times
4Ease of manufacture
If discrete components are used on a printed circuit board, then the system is easier to assemble, but electromagnetic interference increases and power efficiency decreases
Solution Approach 1:
The patent merges all components onto a single integrated substrate, eliminating the separate printed circuit board assembly. This integration reduces electromagnetic interference by minimizing the area over which electromagnetic fields can propagate and by allowing better control of signal paths, while the standardized substrate fabrication maintains assembly ease
5Device complexity
If power converters are placed far from the processor, then the layout is simpler, but dynamic changes in processor power consumption require larger power supply margins
Solution Approach 1:
The patent merges the power converter and processor onto the same substrate, enabling very close proximity placement. This reduces the inductance and impedance of power delivery paths, allowing faster response to dynamic power changes and reducing the need for large power supply margins, while the integrated layout maintains simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in high system energy efficiency, reduced EMI, improved performance, and a smaller footprint, achieving up to 30-50% system energy savings and faster dynamic voltage scaling, while simplifying power architecture and reducing the bill of materials.
Implementation Method 1
first grounded Faraday component embedded in the first substrate and covering one or more surfaces of the first voltage regulator component
Data Source
AI summary
A semiconductor device includes a substrate module and a first processor. The substrate module includes a first substrate, a first voltage regulator component and a first grounded Faraday component. The first voltage regulator component is embedded in the first substrate and includes a plurality of surfaces. The first grounded Faraday component is embedded in the first substrate and covers one or more of the surfaces of the first voltage regulator component. The first processor is disposed over the substrate module.