Embedded Relay Circuit Board Layout for PCB Miniaturization
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Solution Overview
Problem
Existing relays are bulky due to their thickness, which makes them incompatible with the miniaturization trend in electronic products, resulting in increased overall size of circuit boards.
Innovation Solution
The development of a relay circuit board that embeds a magnetic induction element and a switch assembly within the circuit board, reducing the overall size by integrating these components into the board itself.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a relay is externally mounted on a circuit board, then the relay can be easily installed and replaced, but the overall size of the circuit board becomes large
Solution Approach 1:
The patent merges the relay components (coil loops, magnetic induction element, and switch assembly) directly into the circuit board structure. The coil loops are embedded in the inner wall of the second cavity, the magnetic induction element is disposed in the second cavity, and the switch assembly is disposed in the first cavity, creating an integrated embedded relay circuit board that eliminates the need for external mounting while reducing overall size
Solution Approach 2:
The patent implements nesting by placing the coil loops, magnetic induction element, and switch assembly within cavities formed in the circuit board layers. The first external circuit structure contains a first cavity housing the switch assembly, while the internal circuit structure contains a second cavity housing the magnetic induction element, with both cavities communicating with each other, effectively nesting relay components within the board structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This embedded design significantly reduces the size of the relay circuit board while maintaining functionality, aligning with the miniaturization requirements of modern electronic products.
Implementation Method 1
the internal circuit structure includes a plurality of coil loops, the plurality of coil loops surround the magnetic induction element and are embedded in an inner wall of the second cavity, wherein when the coil loops are energized, the magnetic induction element generates a magnetic field
Implementation Method 2
The magnetic induction element uses the magnetic field to attract the moving part such that the moving part is connected to the magnetic induction element
Data Source
AI summary
A relay circuit board includes a first external circuit structure, a second external circuit structure, an internal circuit structure, a magnetic induction element, and a switch assembly. The internal circuit structure is disposed between the first external circuit structure and the second external circuit structure. The switch assembly is disposed in a first cavity of the first external circuit structure. The magnetic induction element is disposed in a second cavity of the internal circuit structure. The internal circuit structure includes a plurality of multiple coil loops. The coil loops surround the magnetic induction element and are embedded in an inner wall of the second cavity. When the coil loops are energized, the magnetic induction element generates a magnetic field.


