Embedded RF Circuit Board With Cold Plate Heat Extraction
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Solution Overview
Problem
The thermal resistance of certain layers in multi-embedded circuit boards limits their operational parameters, particularly the radio frequency power output due to inadequate heat dissipation from amplifier components.
Innovation Solution
Incorporating a power amplifier within a substrate with waveguide launchers and coupling it to a cold plate with cooling elements to enhance heat extraction, and using interconnection join layers with vias for electrical coupling between stacked circuit boards to form an integrated module with predetermined electromagnetic communication characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple circuit boards are combined in a single integrated assembly to increase signal processing capabilities, then the functional integration and signal processing capability are improved, but the thermal resistance increases and heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces a third dimension for heat dissipation by implementing a cold plate system that extends vertically through the multi-layer circuit board assembly. Thermal vias conduct heat from power amplifier components in upper layers down to the cold plate, creating a vertical heat extraction pathway that operates independently from the horizontal signal processing layers, thus resolving the thermal resistance issue while maintaining functional integration
Solution Approach 2:
The cold plate serves as a thermal intermediary between the heat-generating power amplifier components and the external cooling system. Thermal vias act as intermediate conductors, transferring heat from multiple circuit board layers through the cold plate, which then dissipates heat to the environment, effectively mediating the thermal management across the integrated assembly
2Power
If power amplifier components are added to increase radio frequency power output, then the power output capability is improved, but the thermal load increases and heat dissipation becomes insufficient
Solution Approach 1:
The patent extracts the thermal management function from the circuit board structure by implementing a separate cold plate system. The cold plate is thermally coupled to power amplifier components through thermal vias, extracting heat directly from the heat-generating components without interfering with the electrical signal paths, thereby enabling higher power output while maintaining effective heat dissipation
Solution Approach 2:
The thermal management system is segmented into distinct functional elements: thermal vias for heat conduction, cold plate for heat extraction, and cooling channels for heat dissipation. This segmentation allows each component to be optimized independently, with the cold plate specifically dedicated to handling the thermal load from power amplifiers, enabling increased RF power output without thermal overload
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases RF power output by minimizing thermal resistance and improving heat dissipation, enabling higher performance and reduced assembly errors in phased array antenna systems and radio frequency repeaters.
Implementation Method 1
a cold plate thermally coupled to the first circuit board, the cold plate includes one or more cooling elements configured to extract heat from the power amplifier
Data Source
AI summary
A multi-embedded circuit board includes a first circuit board and a first cold plate thermally coupled to the first circuit board. The first circuit board includes a substrate and a power amplifier within the substrate, the power amplifier electrically coupled to one or more electromagnetic signal interfaces. The first cold plate includes one or more first cooling elements configured to extract heat from the power amplifier.