Embedded RF Circuit Board for 5G MIMO Antenna Integration
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Solution Overview
Problem
The increasing number of antennas on circuit boards due to 5G MIMO technology leads to larger board sizes, posing a challenge for compact signal transmission in mobile communications.
Innovation Solution
A method for manufacturing a circuit board that embeds communication units, including RF components and antennas, within a rigid substrate, using a combination of wiring layers, insulating layers, and encapsulation to reduce size while maintaining electrical connectivity, and forming receiving grooves to integrate these units, allowing for compact and efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple antennas are included in a single circuit board to support 5G MIMO technology, then signal transmission quality is improved, but the circuit board size increases
Solution Approach 1:
The patent embeds communication units (including antennas and RF components) within recesses or grooves formed in the circuit board substrate. This nesting approach allows multiple antennas to be integrated into the board structure without increasing the overall board footprint, as the antennas are housed within the existing board volume rather than extending beyond it.
Solution Approach 2:
The patent utilizes vertical integration by forming communication units that extend into the thickness of the board through recesses and encapsulation layers. This three-dimensional arrangement allows multiple antennas to be stacked or positioned at different depths within the board structure, effectively using the vertical dimension to accommodate more antennas without expanding the horizontal board area.
2Area of stationary object
If communication units are embedded within the rigid substrate, then circuit board size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent forms recesses in the rigid substrate before embedding the communication units. This preliminary preparation of the substrate structure simplifies the subsequent embedding process by providing pre-defined cavities that guide the placement and encapsulation of communication units, reducing the overall manufacturing complexity despite the advanced embedding technique.
Solution Approach 2:
The patent combines multiple manufacturing steps into an integrated process where communication units are embedded, encapsulated, and electrically connected in a unified manufacturing flow. The encapsulation layer simultaneously protects the communication units and provides electrical connections, merging protection and connectivity functions into a single structural element that simplifies the overall manufacturing process.
Data Source
AI summary
A method for manufacturing a circuit board with a small size a communication unit comprising a radio frequency (RF) component, an antenna, and an encapsulation layer. The RF component is embedded in the encapsulation layer, the antenna is positioned on the encapsulation layer and electrically connected to the RF component. A rigid substrate is formed on a flexible substrate, and a receiving groove is defined in the rigid substrate to expose the flexible substrate. The communication unit is in the receiving groove, thus causing connection between the RF component and the flexible substrate, thereby the circuit board is formed.