Embedded RF Transceiver PCB Layout With Keep-Out Shielding
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Solution Overview
Problem
Compact head-wearable communication devices face challenges in integrating radio-frequency transceivers due to size constraints and signal interference from conductive materials, making it difficult to embed radio-frequency transceivers in printed circuit board (PCB) modules while maintaining functionality.
Innovation Solution
A multilayer PCB module is designed with an embedded radio-frequency transceiver, where the active side of the transceiver faces the outer surface and is shielded by a keep-out volume free from conductive materials, allowing for a smaller form factor and reduced electromagnetic interference, and optionally includes a second embedded transceiver in a back-to-back configuration with EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If radio-frequency transceivers are integrated on semiconductor chips with flip chip configuration, then the transceiver functionality is achieved, but the device size increases and the antenna coil is exposed to signal attenuation and interference from conductive materials
Solution Approach 1:
The patent merges the radio-frequency transceiver with the PCB structure by embedding the semiconductor die directly into the PCB layers. The keep-out volume is integrated into the PCB design, combining the shielding function with the structural support function, thereby reducing overall device size while maintaining transceiver functionality
Solution Approach 2:
The semiconductor die is nested within the multilayer PCB structure, with the active side facing the first outer surface. The keep-out volume is nested within the PCB layers, creating a hierarchical integration that reduces the device footprint while protecting the antenna coil
2Object-affected harmful factors
If keep-out volume is created to shield antenna coil from conductive materials, then electromagnetic interference is reduced, but the PCB design complexity increases and manufacturing difficulty increases
Solution Approach 1:
The PCB is divided into multiple layers with conductive and non-conductive layers interleaved. The keep-out volume is segmented into specific regions within these layers, allowing systematic management of electromagnetic interference while maintaining manageable design complexity through structured layering
Solution Approach 2:
The solution moves from two-dimensional PCB surface design to three-dimensional keep-out volume management. By utilizing the vertical dimension through multilayer construction, the patent creates shielding volumes that reduce electromagnetic interference without significantly increasing planar footprint or excessive design complexity
3Volume of moving object
If semiconductor die is embedded in inner layers of PCB, then form factor is reduced and design flexibility is improved, but the antenna coil becomes more susceptible to signal attenuation
Solution Approach 1:
The keep-out volume acts as an intermediary between the antenna coil and surrounding conductive materials. By positioning this non-conductive shielded volume adjacent to the antenna coil within the embedded structure, the patent protects the coil from signal attenuation while maintaining the compact form factor achieved through embedding
Data Source
AI summary
A printed circuit board (PCB) module comprising a unitarily formed multilayer PCB, where the multilayer PCB comprises a plurality of layers, the plurality of layers comprising interleaved conductive and non-conductive layers, a first outer surface and an opposing second outer surface, the first outer surface comprising one or more components, the second outer surface comprising one or more electrical contacts such as solder bumps, and a first embedded semiconductor die having an active side facing the first outer surface, wherein the first embedded semiconductor die comprises a wireless radio-frequency transceiver such as a Bluetooth-compliant transceiver.