Embedded RF Shield in Semiconductor Substrate Support
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Solution Overview
Problem
Conventional substrate support systems in semiconductor manufacturing face challenges in maintaining high-temperature operations and preventing material erosion and corrosion, as they are limited by the exposure of ground shields to ion bombardment and chemical etchants, which can lead to deformation and corrosion at elevated temperatures.
Innovation Solution
The implementation of a substrate support assembly with an embedded RF electrode, a heater, and a ground shield or Faraday cage within the top puck, where the ground shield is positioned to protect internal components from process precursors and maintain high-temperature operations by preventing parasitic plasma formation and erosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the ground shield is exposed to process precursors for plasma generation, then plasma processing capability is enabled, but material erosion and corrosion occur leading to deformation and degradation
Solution Approach 1:
The patent extracts the ground shield from direct exposure to process precursors by positioning it within the top puck structure. The RF electrode is embedded in the top puck with its bottom surface facing the substrate, and the ground shield is positioned within the top puck to protect internal components from process precursors, thereby preventing erosion and corrosion while maintaining plasma processing capability
Solution Approach 2:
The ground shield is nested within the top puck structure, which itself is part of the substrate support assembly. This nested configuration allows the ground shield to be protected from direct exposure to harsh plasma environments while still functioning to prevent parasitic plasma formation and provide electromagnetic shielding
2Productivity
If high temperature operations are implemented for substrate processing, then processing capability is enhanced, but material corrosion and erosion accelerate
Solution Approach 1:
The ground shield is extracted from the external environment and positioned within the top puck, creating a protected zone that shields internal components from both thermal and chemical degradation. This allows high temperature operations to proceed while the ground shield remains protected from direct exposure to corrosive materials
Solution Approach 2:
The top puck is constructed from ceramic material which provides both thermal stability for high-temperature operations and resistance to chemical corrosion. This composite structure combines the heat generation capability with protection against material degradation
3Adaptability or versatility
If the pedestal is used for both heat generation and plasma generation, then functional versatility is improved, but interference effects occur
Solution Approach 1:
The patent segments the heat generation and plasma generation functions into separate components: the heater embedded in the top puck for heat generation, and the RF electrode for plasma generation. This segmentation eliminates interference effects between the two functions while maintaining functional versatility
Solution Approach 2:
The top puck acts as an intermediary structure that houses both the heater and RF electrode separately. This intermediary configuration allows both heat and plasma generation functions to operate simultaneously without direct interference, as each component is positioned and shielded appropriately within the top puck structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high-temperature substrate processing while protecting the ground shield from corrosive and erosive materials, preventing material degradation and enhancing processing capabilities beyond the limitations of conventional systems.
Implementation Method 1
Internally located heating devices may generate heat within the support that may be transferred conductively to the substrate
Implementation Method 2
The assembly may include an RF electrode embedded within the top puck proximate the substrate support surface
Implementation Method 3
The assemblies may also include a ground shield or Faraday cage embedded within the top puck
Data Source
AI summary
Exemplary support assemblies may include a top puck defining a substrate support surface, where the top puck is also characterized by a height. The assemblies may include a stem coupled with the top puck on a second surface of the top puck opposite the substrate support surface. The assemblies may include an RF electrode embedded within the top puck proximate the substrate support surface. The assemblies may include a heater embedded within the top puck. The assemblies may also include a ground shield embedded within the top puck. The ground shield may be characterized by an inner region extending radially through the top puck. The ground shield may further be characterized by an outer region extending perpendicular to the inner region.