Embedded High Frequency RFID Tag for PCB Identification

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Solution Overview

Problem

Printed circuit boards (PCBs) lack effective counterfeit protection and identification methods, with existing barcode and RFID tag solutions being prone to damage and removal, leading to inadequate tracking throughout their lifecycle.

Innovation Solution

An embedded high frequency RFID system where a passive RFID tag is sealed within a cavity of the PCB using a non-conductive adhesive, allowing for wireless data storage and reading, providing a unique ID that tracks the PCB through its production chain and lifecycle.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If barcodes are etched into the surface of the PCB, then identification is provided, but significant space on the PCB is required

Engineering Contradiction:
Improveidentification capabilityVSAvoidPCB surface area
Core Design Contradiction:
Loss of informationVSArea of stationary object

Solution Approach 1:

The patent replaces the mechanical/visual barcode system with an electromagnetic RFID system. Instead of using visual barcodes that occupy surface area, the invention uses RFID tags that communicate wirelessly through electromagnetic fields, eliminating the need for large printed identification markers on the PCB surface.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention transitions from two-dimensional surface-based identification (barcodes printed on the surface) to three-dimensional embedded identification (RFID tags embedded within the PCB structure). This allows identification data to be stored and accessed without occupying valuable surface real estate on the PCB.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of information

If barcode stickers are attached manually to the surface of the PCBs, then identification is provided, but they can be easily tampered with and/or removed

Engineering Contradiction:
Improveidentification capabilityVSAvoididentification durability
Core Design Contradiction:
Loss of informationVSReliability

Solution Approach 1:

The invention merges the RFID tag with the PCB structure itself by embedding the tag within the PCB layers. This integration ensures that the identification system becomes an inherent part of the PCB rather than a separate attachable component, making it resistant to tampering and removal while maintaining identification capability throughout the PCB's lifecycle.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The RFID tag is nested within the multi-layer structure of the PCB, similar to how dolls are nested within each other. The tag is embedded between PCB layers and secured with adhesive, creating a hierarchical structure where the identification component is protected within the larger PCB structure, preventing easy access or removal.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Loss of information

If RFID tags are added to the surface of the PCB, then identification capability is improved, but they can be damaged and/or removed and thus tend to fail during the lifetime of the PCB

Engineering Contradiction:
Improveidentification capabilityVSAvoididentification longevity
Core Design Contradiction:
Loss of informationVSReliability

Solution Approach 1:

The invention merges the RFID tag with the PCB structure itself by embedding the tag within the PCB layers. This integration ensures that the identification system becomes an inherent part of the PCB rather than a separate attachable component, making it resistant to tampering and removal while maintaining identification capability throughout the PCB's lifecycle.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The invention provides beforehand cushioning by embedding the RFID tag within the PCB structure and securing it with adhesive before the PCB undergoes normal use and handling. This pre-protective measure shields the tag from mechanical damage, environmental factors, and accidental removal that would affect surface-mounted tags, ensuring reliability throughout the PCB's operational lifetime.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

4Reliability

If an embedded RFID tag is sealed within the PCB, then protection from damage and removal is achieved, but manufacturing complexity increases

Engineering Contradiction:
Improvetag protectionVSAvoidPCB manufacturing process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention applies preliminary action by embedding the RFID tag during the PCB manufacturing process itself, before the PCB is completed and shipped. The tag is placed and secured within the PCB layers during assembly, integrating the protection mechanism into the standard manufacturing workflow rather than requiring separate post-manufacturing steps, thus minimizing additional complexity.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The embedded RFID system ensures durable and tamper-proof identification of PCBs, enabling tracking from production to end product, with data storage for quality and serviceability, and allowing for replacement of tags without damaging the board.

Implementation Method 1

a passive RFID tag embedded within a cavity of the non-conductive substrate of the board... The tag is able to comprise a first antenna and a second antenna formed on opposite sides of a flexible tag substrate

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS9092712B2Embedded high frequency RFID
Publication Date: 2015.07.28 FLEXTRONICS AP LLC
  • US9092712B2 patent drawing
  • US9092712B2 patent drawing
  • US9092712B2 patent drawing

AI summary

An embedded high frequency RFID system, method and device comprises a PCB having a non-conductive substrate and conductive traces on the substrate. The non-conductive substrate mechanically supports the PCB and the conductive traces electrically couple electronic components (e.g. microchips, resistors, capacitors) on the board together such that the PCB is able to operate. Additionally, the PCB beneficially comprises a high frequency RFID tag that is embedded within the PCB itself and locked in place by a non-conductive adhesive. As a result, the embedded high frequency RFID system, method and device enables each PCB to store data which gives each PCB sold to a customer a unique ID, which can be read over the life of the product.