Embedded-Electrode SAW Structure for Hybrid Bonding Integration
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Solution Overview
Problem
Current SAW devices face challenges in miniaturization and integration with hybrid bonding packages due to the size constraints of mobile communication devices, particularly in reducing the size of ASIC chips.
Innovation Solution
The method involves forming a first dielectric layer on a substrate, followed by a piezoelectric layer, and then a second dielectric layer. A photo-etching process creates recesses in the second dielectric layer, where a metal layer is deposited to form electrodes, which are then planarized to be coplanar with the dielectric layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If SAW devices are miniaturized to reduce the size of ASIC chips, then the device size is reduced, but the integration with hybrid bonding packages becomes more difficult
Solution Approach 1:
The patent introduces a multi-layer dielectric structure with electrodes embedded at different depths and positions. The first dielectric layer, second dielectric layer, and third dielectric layer create vertical dimensionality, allowing electrodes to be positioned at different heights (first electrode at first depth, second electrode at second depth). This dimensional approach enables compact integration while maintaining proper electrical connections for hybrid bonding packages.
Solution Approach 2:
The patent embeds electrodes within dielectric layers in a nested configuration. The first electrode is embedded in the first dielectric layer, which is then covered by a second dielectric layer containing the second electrode, which is in turn covered by a third dielectric layer. This nested arrangement allows multiple functional elements to be compactly integrated within a small volume, facilitating both miniaturization and ease of integration with hybrid bonding packages.
2Productivity
If the number of communication channels is increased to satisfy communication needs, then the communication capacity is improved, but the device size increases
Solution Approach 1:
The patent divides the device into multiple functional segments with separate electrodes (first electrode and second electrode at different depths and positions) that can independently handle different communication channels or signals. This segmentation allows multiple communication functions to be integrated within a compact structure, increasing communication capacity without proportionally increasing device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the integration of SAW devices into hybrid bonding packages, enhancing their performance by allowing for more compact designs and efficient electrical connections.
Implementation Method 1
performing a photo-etching process to remove the second dielectric layer for forming a recess in the second dielectric layer
Implementation Method 2
SAW device are made of piezoelectric materials such as lithium niobate (LiNbO3) or lithium tantalite (LiTaO3) and since these materials have larger electromechanical coupling coefficient
Data Source
AI summary
A method for fabricating a surface acoustic wave (SAW) device includes the steps of forming a first dielectric layer on a substrate, forming a piezoelectric layer on the first dielectric layer, forming a second dielectric layer on the piezoelectric layer, performing a photo-etching process to remove the second dielectric layer for forming a recess in the second dielectric layer, forming a metal layer in the recess, and then performing a planarizing process to remove the metal layer for forming an electrode in the recess.