Embedded Security Module with On-Die Non-Volatile Memory

Solution Overview

Problem

Existing embedded security module architectures for system-on-chip designs rely on external non-volatile memory, which is costly and inefficient due to the need for significant changes in underlying logic processes, and lacks robustness against manipulation and observation, particularly in preventing replay attacks.

Innovation Solution

An embedded security module integrated on a semiconductor die, comprising a security processor, volatile memory, and non-volatile memory with magnetoresistive or phase-change random-access memory, allowing secure storage and processing of encryption keys, certificates, and code, while maintaining compatibility with existing logic technologies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external non-volatile memory is used for embedded security module, then security functions can be implemented, but manufacturing cost increases and integration complexity increases due to changes in underlying logic process

Engineering Contradiction:

Improvesecurity protectionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the non-volatile memory and security processor into a single integrated security module die. The non-volatile memory is formed using the same semiconductor layer structure as the logic die, eliminating the need for separate external memory components and reducing manufacturing complexity while maintaining security functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The security module is nested within the system-on-chip architecture, with the non-volatile memory embedded within the semiconductor layers of the logic die. This nested integration allows the security functions to be embedded within the existing chip structure without requiring separate external components.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If external non-volatile memory is used for embedded security module, then security functions can be implemented, but integration complexity increases due to changes in underlying logic process

Engineering Contradiction:

Improvesecurity protectionVSAvoidintegration complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the non-volatile memory and security processor into a single integrated security module die. The non-volatile memory is formed using the same semiconductor layer structure as the logic die, eliminating the need for separate external memory components and reducing manufacturing complexity while maintaining security functionality.

Inventive Principle:

Principle #5Merging (Combining)

3Quantity of substance

If external non-volatile memory is used for embedded security module, then basic storage function is provided, but security against manipulation and replay attacks is insufficient

Engineering Contradiction:

Improvestorage capacityVSAvoidresistance to manipulation and replay attacks

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent merges the non-volatile memory and security processor into a single integrated security module die. The non-volatile memory is formed using the same semiconductor layer structure as the logic die, eliminating the need for separate external memory components and reducing manufacturing complexity while maintaining security functionality.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides enhanced security and cost-effectiveness by integrating non-volatile memory directly on the semiconductor die, ensuring secure storage and processing of sensitive information without the need for external memory, while being robust against manipulation and replay attacks.

Implementation Method 1

a magnetoresistive random-access memory or a phase-change random-access memory embedded in the embedded security module

Methodology Applied

Scientific EffectMagnetoresistance: Magnetoresistance

Implementation Method 2

a magnetoresistive random-access memory or a phase-change random-access memory embedded in the embedded security module

Methodology Applied

Scientific EffectPhase change: Phase Change

Data Source

PatentUS9471793B2System on chip with embedded security module

Publication Date: 2016.10.18 INFINEON TECHNOLOGIES AG

AI summary

An embedded security module includes a security processor, volatile and non-volatile memory, and an interface. The security processor includes transistors formed in one or more semiconductor layers of a semiconductor die, and implements one or more security-related functions on data and/or code accessed by the security processor. The volatile memory is fabricated on the same semiconductor die as the security processor and stores the data and/or code accessed by the security processor. The non-volatile memory includes non-volatile storage cells disposed above each semiconductor layer of the semiconductor die, and securely stores at least one of the data and/or code accessed by the security processor and security information relating to the data and/or code accessed by the security processor. The interface is fabricated on the same semiconductor die as the security processor and provides a communication interface for the security processor.