Embedded Semiconductor Die with Substrate-to-Substrate Interconnects
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Solution Overview
Problem
Conventional semiconductor packages with single-layered structures often suffer from warpage due to their lamellar structure, which can be mitigated by using mold members, but this results in excessive thickening of the structure.
Innovation Solution
A semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects is manufactured using conductive bumps and mold materials to create a robust structure, where the semiconductor die is bonded to a substrate with top and bottom conductive bumps, and extended substrates are coupled using these bumps, with mold materials encapsulating the bumps and substrate surfaces to maintain structural integrity without excessive thickening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If mold members are used to stiffen the single-layered structure, then warpage is mitigated, but the structure becomes excessively thick
Solution Approach 1:
The patent divides the package structure into multiple layers (first substrate, second substrate, intermediate layer) with conductive bumps and mold materials strategically placed at different levels. This segmentation provides distributed reinforcement that prevents warpage without requiring excessive thickness in any single layer, resolving the contradiction between stability and thickness control
Solution Approach 2:
The patent employs composite construction combining different materials (substrates, conductive bumps, mold materials, intermediate layers) with complementary properties. Each material contributes specific functions (mechanical strength, electrical conductivity, structural support) that collectively achieve warpage resistance while maintaining overall structure thickness within acceptable limits
2Ease of manufacture
If a single-layered lamellar structure is used, then manufacturing is simple, but warpage occurs
Solution Approach 1:
The package is segmented into multiple manufacturable layers that can be fabricated and assembled using standard semiconductor packaging processes. Each layer serves a specific function and can be processed independently, maintaining manufacturing simplicity while the combined multi-layer structure provides the structural stability needed to prevent warpage
Solution Approach 2:
The patent introduces intermediate layers and mold materials as intermediary elements between substrates and conductive bumps. These intermediaries facilitate assembly, provide structural support, and enable the multi-layer construction to achieve both manufacturing feasibility and structural stability
Data Source
AI summary
A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the substrate, and a first conductive bump that is on the top surface of the substrate and is at least partially encapsulated by the first mold material. An extended substrate may be coupled to the substrate utilizing the first conductive bump. A second conductive bump may be formed on the bottom surface of the substrate, and a second mold material may encapsulate at least a portion of the second conductive bump and at least a portion of the bottom surface of the substrate. A third mold material may be formed between the first mold material and the extended substrate.