Embedded Semiconductor Module PCB Inner Space Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor modules face issues with thermal expansion coefficient differences between semiconductor packages and printed circuit boards (PCBs) leading to crack generation in outer terminals, disconnecting electrical connections, and the difficulty in repairing or exchanging defective terminals due to molding members, which also result in increased module thickness.
Innovation Solution
A semiconductor module design where the semiconductor package is received within an inner space of the PCB, surrounded by electrode patterns and insulating layers with exposed openings, eliminating the need for a molding member and allowing for easy repair or replacement of outer terminals, while maintaining a thin module thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a molding member is used to protect outer terminals, then protection from external impacts is improved, but ease of repair and device thickness are worsened
Solution Approach 1:
The patent removes the molding member from the semiconductor package structure, extracting the protective function and replacing it with an alternative approach. The outer terminals are designed to extend directly from the PCB without requiring a molding member for protection, allowing easy access for repair and replacement while eliminating the thickness increase caused by molding encapsulation.
2Reliability
If outer terminals are mounted on PCB surface, then electrical connection is achieved, but thermal expansion coefficient difference causes cracks and disconnection
Solution Approach 1:
The patent embeds the outer terminals within recesses or inner spaces of the PCB structure rather than mounting them on the surface. This nesting approach allows the terminals to be surrounded and supported by the PCB material, distributing thermal stress and preventing crack propagation while maintaining electrical connection reliability.
3Ease of manufacture
If semiconductor package is arranged on PCB surface, then mounting is achieved, but module thickness becomes very thick
Solution Approach 1:
The patent transitions from a surface-mounted configuration to a recessed or embedded configuration by utilizing the vertical dimension of the PCB. The semiconductor package and outer terminals are positioned within inner spaces of the PCB rather than on the surface, effectively reducing the overall module thickness while maintaining ease of manufacture through standardized recessed mounting processes.
Data Source
AI summary
A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that cracks may not be generated in the outer terminals.