Embedded Semiconductor Package Structure Without Core Board
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Solution Overview
Problem
Existing semiconductor package structures with embedded semiconductor components face challenges such as poor electrical connection quality, inefficient heat dissipation, increased thickness due to core boards, and high fabrication costs, particularly due to the need for precise alignment and conductive through holes.
Innovation Solution
A package structure with a semiconductor component embedded in a dielectric layer, where the semiconductor chip protrudes from the layer and is aligned with high precision using a carrier layer, and a metal layer serves as a heat-dissipating component, eliminating the need for a core board and conductive through holes, thereby simplifying the fabrication process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a core board with opening is used to embed semiconductor chip, then electrical connection can be established, but alignment precision deteriorates due to displacement of semiconductor chip
Solution Approach 1:
A carrier board is introduced as an intermediary substrate to support the semiconductor chip during the embedding process. The carrier board provides a stable platform that prevents chip displacement, while conductive bumps on the carrier board ensure proper electrical alignment and connection between the chip and the package structure.
2Reliability
If core board with conductive through holes is used, then electrical connectivity is achieved, but device complexity increases
Solution Approach 1:
The invention extracts and eliminates the core board from the package structure. Instead of using a traditional core board with conductive through holes, the package substrate directly provides the necessary electrical connections through its own conductive structures, simplifying the overall device architecture and fabrication process.
3Stability of the object's composition
If core board is used for embedding semiconductor chip, then structural support is provided, but overall thickness increases
Solution Approach 1:
The core board is completely removed from the package structure. The package substrate alone provides the necessary structural support for embedding the semiconductor chip, eliminating the additional thickness contributed by the core board while maintaining structural integrity.
4Volume of moving object
If semiconductor chip is embedded in opening of core board, then compact size is achieved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The carrier board serves as a heat dissipation intermediary between the semiconductor chip and the package substrate. It provides a thermal conduction path that efficiently transfers heat away from the chip, preventing overheating while maintaining the compact embedded structure.
Data Source
AI summary
A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a manner that the semiconductor chip protrudes from the second surface, and having an active surface and an inactive surface opposing the active surface, electrode pads being disposed on the active surface and in the first dielectric layer, the inactive surface and a part of a side surface adjacent the inactive surface protruding from the second surface; a first circuit layer disposed on the first surface; a built-up structure disposed on the first surface and the first circuit layer; and an insulating protective layer disposed on the built-up structure, a plurality of cavities being formed in the insulating protective layer for exposing a part of a surface of the built-up structure. The package structure includes only one built-up structure.