Embedded Semiconductor Package Structure for Reduced Thickness
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Solution Overview
Problem
Conventional semiconductor package structures with rigid boards result in increased thickness, making it difficult to achieve compact, highly integrated designs.
Innovation Solution
A semiconductor package structure is fabricated without a rigid board, using a release member with conductive pads and conductive elements, where the semiconductor component is embedded in a dielectric layer, and the package body is formed with exposed conductive pads and conductive elements, allowing for reduced thickness and simplified photo-resistant insulation packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid board is used to support the chip and cover layer, then structural stability is improved, but the overall thickness of the package structure increases
Solution Approach 1:
The patent removes the rigid board from the package structure entirely, extracting the problematic component that caused increased thickness. The chip is directly mounted on the support structure without requiring a separate rigid board, thereby reducing overall package thickness while maintaining necessary structural stability through alternative design arrangements.
Solution Approach 2:
The patent merges the functions of the rigid board and support structure into a single integrated support structure. By combining these previously separate components, the design eliminates the need for additional thickness while maintaining structural integrity, as the support structure directly provides both mechanical support and positioning functions.
2Adaptability or versatility
If multiple layers including cover layer, dielectric layer, and circuit layer are stacked, then functional integration is improved, but manufacturing complexity increases
Solution Approach 1:
The patent forms conductive elements and conductive pads in advance during the package body formation process, before final assembly. This preliminary action allows subsequent wiring and connection steps to be simpler and more direct, reducing overall manufacturing complexity while achieving the same functional integration through pre-positioned conductive structures.
Data Source
AI summary
A semiconductor package structure and a method of fabricating the same are provided. The semiconductor package structure includes a package body having opposing first and second surfaces; a plurality of first conductive pads and a plurality of second conductive pads formed on the first surface of the package body; a semiconductor component embedded in the package body and electrically connected to the first conductive pads; and a plurality of conductive elements embedded in the package body, each of the conductive elements having a first end electrically connected to a corresponding one of the second conductive pads and a second end opposing the first end and exposed from the second surface of the package body. Since the semiconductor component is embedded in the package body, the thickness of the semiconductor package structure is reduced.