Embedded Semiconductor PCB With Integrated Electromagnetic Shielding
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Solution Overview
Problem
Multilayer printed circuit boards face challenges in ensuring reliable electrical connectivity and electromagnetic shielding between semiconductor elements and conductor circuits, leading to potential signal interference and malfunction.
Innovation Solution
A multilayer printed circuit board design featuring a resin-insulating layer with embedded semiconductor elements, a conductor circuit connected via a via hole, and an electromagnetic shielding layer formed by a side metal layer or bottom metal layer, which can include multiple metal columns or a metal layer coating non-through holes, providing shielding against electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor elements are embedded in a substrate without electromagnetic shielding, then device complexity is reduced, but electromagnetic interference affects signal reliability
Solution Approach 1:
An electromagnetic shielding layer is introduced as an intermediary between the semiconductor element and the external environment. This shielding layer, formed by a side metal layer and/or bottom metal layer, acts as a mediator that blocks electromagnetic interference from reaching the semiconductor element, thereby improving electrical connection reliability without adding complex external shielding structures
Solution Approach 2:
The electromagnetic shielding layer is nested within the substrate structure itself, with the side metal layer formed on the resin insulating layer surrounding the concave portion and the bottom metal layer formed on the bottom of the concave portion. This nested configuration integrates the shielding function directly into the substrate, providing protection while maintaining a compact design
2Object-affected harmful factors
If electromagnetic shielding layer is added around semiconductor elements, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The electromagnetic shielding function is merged with the existing substrate structure. The side metal layer and bottom metal layer are formed as integral parts of the substrate manufacturing process, combining the shielding function with the mechanical support and electrical connection functions already present in the multilayer printed circuit board structure
Solution Approach 2:
The electromagnetic shielding is applied locally only around the concave portion where the semiconductor element is embedded, rather than providing blanket shielding across the entire substrate. The side metal layer surrounds only the specific area needing protection, and the bottom metal layer covers only the bottom of the concave portion, providing targeted shielding that reduces overall complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances electrical connection reliability and reduces electromagnetic interference, ensuring stable operation of semiconductor elements by effectively shielding them from external electromagnetic influences.
Implementation Method 1
an electromagnetic shielding layer is formed on a resin-insulating layer surrounding the concave portion
Implementation Method 2
a via hole provided on the insulating layer to electrically connect the conductor circuit to a pad of the semiconductor elements
Data Source
AI summary
A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.