Embedded Sensor Circuit Layout for Compact Shared-Control Electronics
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Solution Overview
Problem
Existing electronic devices face challenges in integrating diverse functional elements efficiently due to limitations in packaging technologies, which hinder optimal configuration and space utilization.
Innovation Solution
The integration of a circuit structure with a sensing element and a control unit, where the sensing element is embedded within the circuit structure, and a minimum distance between the sensing element and the control unit is maintained, allowing for shared control by a single control unit, thereby optimizing space and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple control units are used for different functional elements, then each element can be controlled independently, but the device complexity and space requirements increase
Solution Approach 1:
The patent implements a universal control unit that can control multiple different functional elements (sensing element, emitting element, heating element) through a unified control architecture. This single control unit replaces what would traditionally require multiple separate control units, reducing device complexity while maintaining the ability to independently control each functional element through software or control logic
2Area of stationary object
If functional elements are placed closer together to save space, then space utilization improves, but interference between elements increases
Solution Approach 1:
The patent introduces shielding structures (such as ground shields or electromagnetic shields) positioned between functional elements like the sensing element and emitting element. These intermediary shielding structures block or reduce electromagnetic interference and other harmful interactions between closely spaced elements, allowing compact arrangement while maintaining signal integrity and reducing cross-talk
3Productivity
If sensing element is embedded in circuit structure, then integration density improves, but manufacturing complexity increases
Solution Approach 1:
The patent designs the circuit structure with pre-formed recesses, cavities, or designated embedding regions that are created during the standard circuit board manufacturing process. The sensing element is then embedded into these pre-prepared structures, which simplifies the manufacturing process compared to creating embedding structures after circuit fabrication. This preliminary preparation of embedding locations maintains high integration density while avoiding complex post-processing steps
Data Source
AI summary
An electronic device includes a control unit, a circuit structure, a sensing element and an emitting element. The circuit structure is disposed on the control unit, the sensing element is embedded in the circuit structure, and the emitting element is disposed on the circuit structure. A minimum distance between the sensing element and the control unit is less than a minimum distance between the emitting element and the control unit.


