Embedded Sensor Connector Assembly for Thermal Stress Relief
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Solution Overview
Problem
Soldered connections between temperature sensors and a temperature controller in substrate processing systems fail due to thermal stress, leading to disconnection and the need for frequent replacement of the substrate support and controller.
Innovation Solution
A connector system with electrically conductive pads and wires embedded in the ceramic substrate support, where the first ends of electrical conductors are reflow soldered to the pads and secured with a potting material to enhance reliability, and a retainer holds the conductors in place, ensuring stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldered connections are used between temperature sensors and temperature controller, then electrical connection is established, but the connection fails due to thermal stress
Solution Approach 1:
The patent introduces an intermediary flexible printed circuit board (FPCB) between the rigid substrate support and the temperature controller. The FPCB acts as a mediator that absorbs thermal expansion differences and mechanical stress, preventing direct stress transmission to the solder joints. This resolves the contradiction by maintaining electrical connection reliability while protecting the solder joint strength through the buffering action of the flexible circuit board.
Solution Approach 2:
The patent changes the physical state and properties of the connection system by introducing a flexible component that can dynamically adjust its mechanical properties. The FPCB's flexibility allows it to accommodate thermal cycling and mechanical movements, changing the stress distribution parameters in the connection system. This resolves the contradiction by transforming the rigid connection into a flexible one that can withstand thermal stress while maintaining electrical connectivity.
2Measurement precision
If temperature sensors are embedded in ceramic substrate support, then temperature measurement is achieved, but frequent replacement is needed due to connection failure
Solution Approach 1:
The FPCB serves as an intermediary that isolates the embedded temperature sensors from mechanical and thermal stress. By placing the flexible circuit board between the ceramic substrate support and the external wiring, the system protects the temperature sensors while maintaining their measurement function. This resolves the contradiction by preserving temperature measurement precision while extending the substrate support's service life through stress isolation.
Solution Approach 2:
The patent applies beforehand cushioning by pre-installing the flexible printed circuit board as a protective element before connection failure can occur. The FPCB is designed to absorb and distribute thermal and mechanical stress before it reaches the temperature sensors and solder joints, providing preventive protection. This resolves the contradiction by maintaining measurement precision while extending device duration through proactive stress management.
3Reliability
If rigid soldered connections are used, then electrical connectivity is achieved, but thermal stress causes disconnection
Solution Approach 1:
The patent replaces rigid soldered connections with a flexible printed circuit board that can accommodate thermal expansion and contraction. The FPCB's flexible nature allows it to bend and deform elastically under thermal stress, preventing disconnection while maintaining electrical connectivity. This resolves the contradiction by eliminating the harmful effect of thermal stress on rigid connections while preserving reliable electrical connection through the flexible circuit board.
Solution Approach 2:
The patent transitions from a static rigid connection to a dynamic flexible connection. The FPCB can dynamically adjust its shape and position in response to thermal and mechanical changes, maintaining electrical connection stability throughout operation. This resolves the contradiction by making the connection system adaptive to thermal stress rather than rigid and vulnerable, thereby improving reliability while reducing thermal stress impact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable and durable electrical connection between temperature sensors and the temperature controller, reducing the frequency of substrate support and controller replacements by mitigating the effects of thermal stress.
Implementation Method 1
the first ends are electrically connected to the electrically conductive pads, respectively, via reflow soldering
Implementation Method 2
a retainer holds the conductors in place, ensuring stable electrical connections
Implementation Method 3
secured with a potting material to enhance reliability
Data Source
AI summary
An electrical connector includes first, second, third, and fourth electrical conductors. The first, second, third, and fourth electrical conductors each include a first end to be electrically connected to a respective electrically conductive pad formed on a surface of a ceramic layer of a substrate support and a second end to be electrically connected to a respective wire within a through hole in the substrate support. The electrical connector also includes a retainer to hold the first, second, third, and fourth electrical conductors in place.