Embedded Sensor Electronic Package Thickness Reduction
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Solution Overview
Problem
Conventional electronic package structures, such as wire-bonding and COB types, face challenges in achieving thinness due to the thickness of encapsulants and the complexity of fabricating conductive through silicon vias, which are costly and difficult to integrate, especially for sensor elements and camera lenses.
Innovation Solution
The electronic package embeds an electronic element with a sensing area and electrode pads in an insulating layer, where a first circuit layer is in electrical contact with the electrode pads, and the sensing area is exposed, eliminating the need for bonding wires and allowing easier control of thickness, with optional additional circuit layers and conductive posts for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If wire-bonding type package structure is used with encapsulant covering sensing area, then electrical connection is achieved, but encapsulant thickness cannot be controlled precisely and package cannot be thinned
Solution Approach 1:
The patent removes the encapsulant layer entirely by embedding the electronic element directly into the insulating layer. This extraction of the encapsulant function eliminates the thickness control problem while maintaining protection and electrical connection functions through the insulating layer and conductive structures.
Solution Approach 2:
The patent merges the encapsulant function with the insulating layer and conductive structures. The insulating layer serves both as the embedding medium and the protective enclosure, while conductive posts and circuit layers provide both electrical connection and structural integration, eliminating the need for separate encapsulant thickness control.
2Length of moving object
If COB type package structure with transparent element and support members is used, then light sensing is enabled, but package thickness cannot be reduced
Solution Approach 1:
The patent removes the transparent element and support members by embedding the electronic element directly into the insulating layer. This extraction eliminates the structural complexity and thickness issues while maintaining the light sensing function through the exposed sensing area and insulating layer transparency.
Solution Approach 2:
The patent merges the support function with the insulating layer itself, which provides both mechanical support and electrical isolation. The conductive posts integrate both electrical connection and structural positioning functions, eliminating the need for separate support members and reducing overall thickness.
3Ease of manufacture
If conductive through silicon vias are used for electrical connection, then direct connection is achieved, but fabrication cost increases and integration difficulty increases
Solution Approach 1:
The patent replaces expensive and complex conductive through silicon vias with simpler conductive posts formed within the insulating layer. These conductive posts provide sufficient electrical connection without requiring the high-cost TSV fabrication process, reducing manufacturing cost while maintaining connection reliability.
Solution Approach 2:
The patent introduces conductive posts as intermediary elements between the electronic element and circuit layers. These conductive posts serve as reliable electrical connectors without requiring direct through-silicon vias, providing a cost-effective and manufacturable solution that maintains electrical connection reliability.
Data Source
AI summary
An electronic package is provided, which includes: an insulating layer; an electronic element embedded in the insulating layer and having a sensing area exposed from the insulating layer; and a circuit layer formed on the insulating layer and electrically connected to the electronic element, thereby reducing the thickness of the overall package structure.