Embedded Sensor Package Structure for Shorter Signal Paths
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Solution Overview
Problem
Conventional sensor package structures have long signal transmission paths and large sizes, which hinder performance improvement and miniaturization.
Innovation Solution
A sensor package structure with a substrate, sensor chip, metal wires, embedded module, and a light-permeable cover or sheet, featuring a recessed accommodating slot and a ring-shaped frame and supporting layer to shorten signal paths and miniaturize the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional sensor package structure is used, then the structure is simple to manufacture, but the signal transmission path is too long which reduces performance
Solution Approach 1:
The patent transitions from a planar signal transmission path to a three-dimensional vertical path by embedding the processor in a recessed slot and routing signals through the substrate thickness, thereby shortening the horizontal signal path while adding vertical dimensionality to the package structure
Solution Approach 2:
The processor is nested within the recessed slot of the substrate, and the encapsulant is nested around the processor and metal wires, creating a compact hierarchical structure that reduces overall signal path length while maintaining manufacturing feasibility
2Volume of moving object
If a conventional sensor package structure is used, then the manufacturing process is straightforward, but the overall size is too large which hinders miniaturization
Solution Approach 1:
The invention utilizes the vertical dimension by creating a recessed slot in the substrate and placing the processor within it, allowing the package to be miniaturized in the horizontal plane while using the vertical space for component placement and signal routing
Solution Approach 2:
The substrate, processor mounting structure, and signal routing paths are merged into a single integrated substrate structure with embedded features, eliminating the need for separate mounting components and reducing overall package volume
3Length of moving object
If the processor is placed on the lower surface of the substrate, then the signal transmission path is shortened, but the processor protrudes from the lower surface increasing package height
Solution Approach 1:
The substrate is designed with an asymmetric recessed slot that breaks the symmetry of a flat substrate surface, allowing the processor to be positioned within the recess to reduce protrusion while maintaining short signal paths through the substrate thickness
Data Source
AI summary
A sensor package structure includes a substrate, a sensor chip disposed on a top side of the substrate, a plurality of metal wires connecting the substrate and the sensor chip, an embedded module embedded in a bottom side of the substrate, and a light-permeable cover that is assembled to the top side of the substrate. The substrate has an accommodating slot recessed in the bottom side of the substrate, and the embedded module is disposed in the accommodating slot and includes a processor, an underfill layer, and an inner encapsulant. The processor is connected to the substrate through solders, and the processor is electrically coupled to the sensor chip through the substrate and the metal wires. The solders are embedded in the underfill layer, the accommodating slot is fully filled with the inner encapsulant, and the processor and the underfill layer are embedded in the inner encapsulant.