Embedded Die Sensor Package Warpage Reduction
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Solution Overview
Problem
The existing methods for packaging fingerprint sensor devices face challenges such as high cost and performance issues due to the difficulty in integrating separate controller dies and sensing arrays, and the intrinsic warpage of the package affects the quality of fingerprint images.
Innovation Solution
A multilayer substrate with a mold compound layer and patterned metal layers is used to embed a die, with a sensing element formed over the substrate, allowing for electrical connection through the substrate and reducing warpage by combining substrate manufacturing and wafer level packaging technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate controller dies and sensing arrays are packaged using traditional methods, then the sensor device can be assembled, but the packaging process becomes difficult and costly with affected performance
Solution Approach 1:
The patent combines the controller die and sensing array into a single integrated semiconductor device structure. The controller die is embedded within the same package substrate as the sensing array, with interconnect structures providing electrical connection between them. This merging eliminates the need for separate packaging of individual components, simplifying the manufacturing process and reducing overall device complexity while maintaining functional separation.
2Manufacturing precision
If traditional packaging methods are used for fingerprint sensors, then the device can be manufactured, but warpage occurs affecting fingerprint image quality
Solution Approach 1:
The patent modifies the physical and material parameters of the package structure to eliminate warpage. This includes using a multi-layer substrate with controlled thermal expansion coefficients, optimizing the thickness and material composition of dielectric layers, and designing interconnect structures that distribute mechanical stress uniformly. These parameter changes ensure the package remains flat during manufacturing and operation, preserving fingerprint image quality.
3Ease of manufacture
If separate components are used for controller and sensing array, then design flexibility is maintained, but the final sensor device cost increases
Solution Approach 1:
The patent integrates multiple functional components into a single semiconductor package, reducing the total quantity of separate components required. The controller die and sensing array are housed together with shared interconnect structures and common packaging materials. This consolidation reduces material consumption, assembly steps, and overall device cost while maintaining the functional independence and design flexibility of each component.
Data Source
AI summary
A sensor package and a method of forming a sensor package are disclosed. The sensor package comprises: a multilayer substrate comprising a mold compound layer and a plurality of patterned metal layers; an embedded die embedded in the multilayer substrate, wherein the mold compound layer of the multilayer substrate surrounds the embedded die; and, a sensing element disposed over the multilayer substrate, the sensing element comprising a first patterned metal layer electrically connected to the embedded die through the multilayer substrate.