Embedded Sensor PCB for Wearable Physiological Monitoring
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) lack the capability to be compact, readily configurable, and inexpensive while serving as sensing devices with embedded sensors to measure physiological parameters, especially for wearability or implantation in users.
Innovation Solution
A printed circuit board (PCB) design that includes a micro-controller connected via conductive traces to an embedded sensor, allowing for data transmission and configuration as a sensing device that can be carried, worn, affixed, or implanted, with a compact size and simple, cost-effective structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional PCB designs are used, then manufacturing simplicity is maintained, but the device cannot be compacted or configured for wearability and implantation
Solution Approach 1:
The patent merges the sensor, micro-controller, and PCB into a single integrated unit where the sensor is directly mounted on the PCB surface. This consolidation eliminates the need for separate housing structures and reduces overall device volume while maintaining functional complexity through integrated circuit design.
Solution Approach 2:
The patent transitions from conventional planar PCB layouts to a three-dimensional integrated structure where the sensor protrudes from the PCB surface. This dimensional change enables compact packaging and facilitates wearability/implantation applications without increasing the PCB's planar footprint.
2Adaptability or versatility
If embedded sensor technology is added to PCB, then sensing capability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent segments the sensing device into distinct functional modules: the sensor element, the micro-controller unit, and the PCB substrate. This segmentation allows each component to be manufactured and tested independently before final assembly, simplifying the overall manufacturing process while enabling versatile sensing applications.
Solution Approach 2:
The patent designs the PCB with universal mounting structures and conductive trace patterns that can accommodate different sensor types and configurations. This multi-functional design enables the same PCB platform to support various sensing applications without requiring custom manufacturing processes for each variant.
3Volume of moving object
If compact size is achieved for wearability, then device portability is improved, but component density and electrical performance may deteriorate
Solution Approach 1:
The patent employs thin-film conductive traces and flexible mounting structures on the PCB surface. This approach enables compact device packaging while maintaining adequate trace widths and spacing for reliable electrical connections, as the thin-film architecture reduces parasitic inductance and capacitance effects that would otherwise limit miniaturization.
Data Source
AI summary
A sensing device includes a printed circuit board (PCB) having a conductive trace. A micro-controller is attached to the conductive trace and data transmission means is connected to the micro-controller. A sensor is embedded within the PCB and is connected to the micro-controller via the conductive trace. The sensor is configured to sense at least one physiological parameter in a patient.