Embedded Digital Sensor Structures for Stretchable Tactile Arrays
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Solution Overview
Problem
Existing sensor arrays struggle to replicate human-scale tactile sensing, touch, and dexterity due to limitations in flexibility, sensitivity, and susceptibility to parasitic effects, particularly in fine pitch sensor arrays.
Innovation Solution
The development of embedded sensor structures with deformable, stretchable films that incorporate microfabricated sensor packages, mixed signal processing IC dies, flexible polymer layers, and metal routing, featuring strain relief trenches for flexibility and connectivity, along with integrated AFE and ADC circuitry for enhanced sensitivity and reduced latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensor arrays are made with fine pitch to replicate human-scale tactile sensing, then measurement precision is improved, but susceptibility to parasitic effects increases and manufacturing becomes more difficult
Solution Approach 1:
The patent implements a stacked sensor package architecture where multiple sensor dies are vertically stacked and bonded together. This nesting approach allows fine pitch tactile sensors to achieve high measurement precision while the vertical stacking reduces the lateral footprint, minimizing parasitic effects that scale with sensor array density.
Solution Approach 2:
The patent transitions from planar sensor arrays to three-dimensional stacked sensor packages. By moving sensor elements into the vertical dimension through stacking and bonding multiple dies, the system achieves fine pitch tactile sensing capability without increasing lateral sensor density, thereby reducing parasitic effects associated with high-density planar arrays.
2Adaptability or versatility
If sensor arrays are made flexible and stretchable to replicate human touch and dexterity, then adaptability is improved, but structural stability and electrical connectivity become more difficult to maintain
Solution Approach 1:
The patent employs flexible polymer layers as encapsulants and interconnect structures that can stretch and deform with the sensor substrate. These thin film structures maintain electrical connectivity between stacked sensor dies while allowing the overall assembly to flex and stretch, replicating human-scale touch and dexterity without compromising structural integrity.
3Ease of manufacture
If metal routing spans over planarization layer to connect sensor packages, then ease of manufacture is improved, but susceptibility to strain and signal loss increases
Solution Approach 1:
The patent implements strain relief trenches that dynamically accommodate mechanical deformation. These trenches allow the metal routing to flex and deform with the planarization layer during stretching or bending, preventing brittle failure and maintaining signal connectivity. The routing structure transitions from rigid to dynamically adaptable, absorbing strain without compromising electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables highly sensitive, flexible sensor arrays capable of replicating human-scale tactile sensing with reduced latency and signal loss, suitable for applications like wearable devices and large area tactile input surfaces.
Implementation Method 1
The sensor die can include a strain response material on the diaphragm, and between the diaphragm and the IC die
Implementation Method 2
The sensor die additionally includes a diaphragm that is deflectable toward a cavity
Data Source
AI summary
Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.