Embedded Electromagnetic Shield Box for Flip-Side IC Package Height Reduction
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Solution Overview
Problem
Integrating dies on the flip side of a chip package increases the height of the package, leading to issues with signal routing area and electromagnetic/radiofrequency interference in small-form-factor devices like cell phones and laptops.
Innovation Solution
A circuit board design with an electromagnetic shield box positioned beneath the integrated circuit package, allowing dies to be mounted on the flip side without increasing height, using signal traces to route signals under the package and across the hole in the circuit board, and grounding the shield box to reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dies are integrated on the flip side of a chip package, then the performance of integrated circuit components is improved, but the height of the package increases
Solution Approach 1:
The patent utilizes the vertical dimension by mounting dies on both the top and bottom sides of the package substrate, effectively using three-dimensional space to increase component density without significantly increasing the overall package height. This allows integration of additional functional dies while maintaining a compact form factor suitable for small-form-factor devices.
2Length of stationary object
If part of the circuit board is removed to accommodate flip-side dies, then the package height is reduced, but the area available for signal routing is decreased
Solution Approach 1:
The patent segments the circuit board area by creating a localized recess or cavity only in the specific region where the flip-side dies are mounted, rather than removing large portions of the board. This targeted segmentation provides the necessary space for the dies while preserving the majority of the circuit board area for signal routing and other circuitry.
3Length of stationary object
If part of the circuit board is removed to accommodate flip-side dies, then the package height is reduced, but electromagnetic interference risk increases
Solution Approach 1:
The patent converts the potential harmful effect of exposed die edges and removed board material into a beneficial outcome by strategically placing ground shields and reference planes around the recess area. These structures, which could be seen as additional complexity, actually serve to contain electromagnetic fields and prevent interference, turning a potential vulnerability into a controlled electromagnetic environment.
4Object-affected harmful factors
If an electromagnetic shield box is added to reduce interference, then electromagnetic interference is minimized, but the device complexity increases
Solution Approach 1:
The patent merges the electromagnetic shielding function with the existing package structure by integrating ground shields and reference planes into the same recess cavity that houses the flip-side dies. Rather than adding a separate shield box, the shielding structures are combined with the mechanical support structure, reducing overall complexity while maintaining electromagnetic interference protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall height of the system, maintains signal routing capabilities, and minimizes electromagnetic interference, enabling a smaller form factor and potentially longer battery life in devices.
Implementation Method 1
an electromagnetic shield box positioned beneath the integrated circuit package
Data Source
AI summary
Technologies for a shield for electromagnetic interference include a circuit board with an integrated circuit package on it, with a hole in the circuit board under the integrated circuit package. The integrated circuit package may include one or more dies or other components on the underside of the package, at least partially positioned in the hole in the circuit board. An electromagnetic shield box can be positioned in the hole. Tabs of the electromagnetic shield box may interface with pads on the same side of the circuit board as the integrated circuit package. The electromagnetic shield box may prevent or reduce electromagnetic or radiofrequency interference on the components of the integrated circuit package. Positioning the electromagnetic shield box can reduce the overall height of the circuit board, among other advantages.