Embedded Shield PCB Manufacturing for Reliable Large-Frame Soldering
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Solution Overview
Problem
The existing SMT production process faces challenges in sealing larger shielding frames on PCBs, leading to potential soldering defects and reduced production yield, as it struggles with maintaining precision and reliability in the face of increasing circuit complexity.
Innovation Solution
A method involving trench formation on the PCB using CNC milling, laser carving, or engraving, followed by electroplating with a metal layer, filling with solder paste, and securing the shield frame using a reflow oven to ensure a robust connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the existing SMT production process is used to seal larger shielding frames, then the production process can be maintained with current capabilities, but soldering defects occur and production yield decreases
Solution Approach 1:
The patent divides the shielding frame sealing process into multiple stages: first forming a solder paste layer before placing the shielding frame, then performing secondary soldering after placement. This segmentation allows each soldering operation to focus on specific connection requirements, improving overall soldering reliability and reducing defects in large shielding frames.
Solution Approach 2:
The patent applies preliminary action by forming the solder paste layer and performing preliminary soldering before the shielding frame is placed on the PCB. This ensures that the solder joints are already prepared and positioned correctly, preventing soldering defects that would occur if soldering were attempted after frame placement in traditional processes.
2Area of stationary object
If larger shielding frames are used to address increasing circuit complexity, then better shielding coverage is achieved, but manufacturing precision decreases due to gaps between frame and board
Solution Approach 1:
The patent changes the parameter of solder application timing from post-placement to pre-placement. By applying solder paste before the shielding frame is positioned, the system compensates for manufacturing tolerances and alignment variations, ensuring that the solder joints accommodate slight positional deviations without creating gaps or defects.
Solution Approach 2:
The solder paste layer acts as an intermediary substance between the PCB and the shielding frame. This intermediary layer compensates for manufacturing tolerances and alignment variations, ensuring reliable electrical and mechanical connection even when there are slight gaps or misalignments between the frame and the board.
3Device complexity
If traditional post-placement soldering is used for large shielding frames, then the process flow remains simple, but soldering defects increase and connection reliability decreases
Solution Approach 1:
The patent segments the soldering process into distinct phases: pre-placement solder paste application and preliminary soldering, followed by frame placement and secondary soldering. This segmentation improves connection reliability by ensuring that solder joints are properly prepared before frame placement, preventing common defects associated with post-placement soldering of large frames.
Solution Approach 2:
The patent performs preliminary soldering actions before the shielding frame is placed on the PCB. This preliminary action ensures that the solder joints are already formed and positioned correctly, providing a reliable foundation for the frame placement and eliminating the need for complex rework or adjustment after placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the reliability and reduces interference by providing a durable and reliable connection of the shield frame to the PCB, ensuring superior conductivity and reduced interference in electronic devices.
Implementation Method 1
the solder paste is melted to secure the frame of the shield to the PCB via the melted solder paste in the trench
Implementation Method 2
the trench is electroplated with a metal layer
Data Source
AI summary
This invention introduces an advanced method for manufacturing printed circuit boards (PCBs) featuring an embedded shield, enhancing the integrity and functionality of electronic devices. The process involves forming trenches on the PCB, filling them with solder paste, and seamlessly integrating a shield with a frame through a meticulous soldering procedure. This refined technique offers superior reliability and paves the way for more intricate and robust electronic designs.