Embedded Silicon Bridge Layout for High-Density Multi-Die Packaging
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Solution Overview
Problem
Current microelectronic packages face challenges in achieving high-density interconnects between multiple dies due to limitations in organic substrates, which restrict data speed and I/O density, while fully silicon substrates are costly and prone to mechanical stress.
Innovation Solution
The implementation of an embedded multi-die interconnect bridge (EMIB) using localized silicon bridges within the organic package substrate, which provides high-density connections through various topologies such as linear multi-drop, ring, fly-by, and daisy-chained configurations, reducing the need for through-silicon vias and minimizing silicon area, thus balancing the advantages of both silicon and organic structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If organic package substrate is used, then cost is reduced and thermal/mechanical characteristics are preserved, but I/O density and data speed are limited
Solution Approach 1:
The patent introduces an embedded multi-die interconnect bridge (EMIB) as an intermediary component within the organic package substrate. This EMIB acts as a mediator that provides high-density interconnects between dies, enabling I/O densities that exceed the capabilities of the organic substrate alone, while the organic substrate continues to provide cost-effective packaging and thermal management.
2Quantity of substance
If fully silicon substrate is used, then high-density interconnects are achieved, but cost increases and mechanical stress problems occur
Solution Approach 1:
The patent applies local quality by implementing silicon bridges only in specific localized regions where high-density interconnects are needed, rather than using a fully silicon substrate. This allows the package to achieve high I/O density in critical areas while maintaining the cost and mechanical advantages of organic substrate in non-critical areas.
Solution Approach 2:
The patent creates a composite structure combining organic substrate and silicon bridges. This hybrid approach leverages the advantages of both materials: the organic substrate provides cost-effective packaging and thermal characteristics, while the silicon bridges provide high-density interconnect capability where needed, avoiding the mechanical stress issues of a fully silicon construction.
3Volume of moving object
If more dies are packaged in single package, then device size is reduced, but interconnect density requirements increase
Solution Approach 1:
The patent utilizes three-dimensional stacking configurations with vertical interconnects through the EMIB structure. This dimensional transition from planar to vertical interconnection allows multiple dies to be packaged in a compact volume while maintaining high interconnect density through the embedded bridge structure that connects dies in the vertical dimension.
Data Source
AI summary
A multiple die package is described that has an embedded bridge to connect the dies. One example is a microelectronic package that includes a package substrate, a silicon bridge embedded in the substrate, a first interconnect having a first plurality of contacts at a first location of the silicon bridge, a second interconnect having a second plurality of contacts at a second location of the silicon bridge, a third interconnect having a third plurality of contacts at a third location of the silicon bridge, and an electrically conductive line in the silicon bridge connecting a contact of the first interconnect, a contact of the second interconnect, and a contact of the third interconnect each to each other.