Embedded Sintered Heat Spreader for Substrate Thermal Management
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Solution Overview
Problem
Highly integrated semiconductor dies generate significant heat, which cannot be efficiently dissipated by conventional substrates, leading to potential failure or degraded performance, as laminate materials offer poor thermal properties while metallic materials are costly and lack sufficient resistance.
Innovation Solution
A substrate with an embedded sintered heat spreader is created by dispensing sinterable paste with metal particulates into cavities within the substrate, sintering it to form a high thermal conductivity heat spreader, and applying contact surfaces to protect it and facilitate component attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laminate materials are used in substrates, then cost is reduced and resistance is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent applies composite materials by combining sintered metal particles (providing high thermal conductivity) with laminate substrate materials (providing cost-effectiveness and resistance). The sintered heat spreader is formed by sintering metal particles that are embedded within or attached to the laminate substrate, creating a composite structure that simultaneously achieves superior thermal performance, mechanical strength, and cost efficiency.
2Reliability
If metallic materials are used in substrates, then thermal conductivity is improved, but cost increases and resistance decreases
Solution Approach 1:
The patent applies local quality by concentrating the expensive high thermal conductivity metal particles only in the heat spreader region where thermal management is most critical, rather than using metallic materials throughout the entire substrate. The sintered heat spreader is selectively formed in the area directly beneath or adjacent to the semiconductor die, providing enhanced thermal conductivity precisely where needed while maintaining cost-effective laminate materials for the rest of the substrate structure.
3Reliability
If sinterable paste with metal particulates is dispensed into cavities, then thermal conductivity is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-forming cavities in the substrate before dispensing the sinterable paste. These cavities are created in advance to precisely define the location, shape, and volume of the future sintered heat spreader. This preliminary cavity formation simplifies the subsequent sintering process by confining the metal particles and binder within predetermined boundaries, ensuring consistent heat spreader geometry and reducing manufacturing variability.
Solution Approach 2:
The patent uses a binder material as an intermediary that coats the metal particles in the sinterable paste. This binder serves as a temporary holding matrix that maintains particle distribution and structural integrity during dispensing and sintering operations. During the sintering process, the binder is removed or decomposed, leaving behind the sintered metal structure. The binder acts as a mediating substance that enables controlled formation of the heat spreader while facilitating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded sintered heat spreader enhances thermal conductivity and heat dissipation performance, improving the operational reliability of semiconductor dies by providing an efficient heat dissipation path without increasing costs.
Implementation Method 1
the sinterable paste is sintered to create a sintered heat spreader, which is characterized by high thermal conductivity
Implementation Method 2
The embedded sintered heat spreader enhances thermal conductivity and heat dissipation performance, improving the operational reliability of semiconductor dies by providing an efficient heat dissipation path
Data Source
AI summary
The present disclosure relates to a substrate with an embedded sintered heat spreader and a process for making the same. According to an exemplary process, at least one cavity is created through the substrate. Sinterable paste including metal particulates and binder material is then dispensed into the at least one cavity. Next, the sinterable paste is sintered to create a sintered heat spreader, which is characterized by high thermal conductivity. The sintered heat spreader adheres to the inside walls of the at least one cavity, enhancing the overall thermal conductivity of the substrate.