Embedded SiP Antenna Structure for Low-Cost mmWave Integration
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Solution Overview
Problem
Integrating antennas into System in Package (SiP) modules is challenging due to the need for compact and cost-effective solutions that accommodate millimeter wave radio frequencies, requiring innovative methods to embed antennas within the module without increasing complexity or cost.
Innovation Solution
The method involves suspending antennas in molding compound layers within SiP modules using a two-step molding process, where cavities are cut and filled with conductive material, and further molding compound is deposited to enclose the antenna, reducing the overall fabrication cost and complexity while providing mechanical and chemical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antennas are integrated into SiP modules using conventional packaging technologies, then radio frequency communication capability is achieved, but device complexity and fabrication cost increase
Solution Approach 1:
The antenna is merged with the molding compound layers, being enclosed within them rather than being a separate component. This integration eliminates the need for additional antenna housing and mounting structures, reducing overall device complexity while maintaining RF communication capability
Solution Approach 2:
The molding compound layers serve dual functions: providing mechanical protection and chemical protection for components, and simultaneously serving as the antenna enclosure and radiation shielding. This multi-functionality reduces the number of separate components needed
2Adaptability or versatility
If antennas are integrated into SiP modules using conventional packaging technologies, then radio frequency communication capability is achieved, but fabrication cost increases
Solution Approach 1:
The antenna fabrication process is merged with the existing molding compound deposition process. The cavity is created and filled with conductive material during the same molding cycles used for protecting other components, eliminating separate antenna fabrication steps and reducing overall manufacturing cost
Solution Approach 2:
The molding compound deposition process serves multiple purposes: protecting components, creating the antenna cavity, and providing the final antenna enclosure. This multi-functionality reduces the number of manufacturing steps and associated costs
3Volume of moving object
If antennas are made small for compact SiP modules, then integration density is improved, but antenna performance may deteriorate
Solution Approach 1:
The antenna is designed with specific geometric parameters (conductive material shape, size, and configuration within the cavity) that are optimized for millimeter wave frequencies. The molding compound material properties are also selected to support antenna performance at small dimensions
Solution Approach 2:
The antenna structure uses conductive material (such as copper or aluminum) embedded within the dielectric molding compound, creating a composite structure that maintains electrical performance while achieving compact dimensions suitable for SiP modules
4Strength
If molding compound is used to enclose antennas, then mechanical and chemical protection is provided, but shielding and noise performance must be maintained
Solution Approach 1:
The molding compound is formulated as a composite material with embedded conductive particles or fibers, or with a conductive coating applied to the interior surface. This composite structure provides both mechanical protection and electromagnetic shielding, blocking external interference while allowing the antenna to function
Solution Approach 2:
The molding compound exhibits different properties in different regions: the bulk material provides mechanical protection, while the interior surface or specific regions contain conductive elements that provide electromagnetic shielding. This local differentiation of material properties addresses both requirements simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the integration of low-cost, small antennas within SiP modules, reducing fabrication costs and improving shielding and noise performance, while enabling efficient radio frequency communications, particularly suitable for mmWave applications.
Implementation Method 1
The cavity is filled with conductive material, such as copper, aluminum, or silver, using a sputtering process to form the antenna radiating structure and feedline
Data Source
AI summary
System in package (SiP) modules are compact packages that include components such as processors, memory, sensors, and passive components on a single substrate. One low cost and compact way to integrate an antenna into a SiP module is to suspend an antenna in molding compound so that the antenna is embedded in the real estate of the molding compound layer. To embed the antenna, the molding compound is first deposited. A cavity can be cut in the molding compound to hold the antenna. The cavity can be filled with conductive material to form the antenna. Further molding compound can be deposited to cover the antenna and enclose the antenna in the molding compound layer. Ground structures can also be suspended in the molding compound. Such an embedded antenna can be particularly useful for radio applications.