Embedded Solder Bump Chip for Compact Multi-Function Integration
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Solution Overview
Problem
Current chip-on-chip technologies face challenges in integrating diverse functions into a single, compact electronic apparatus, as existing methods do not effectively address the need for lighter and smaller electronic devices.
Innovation Solution
A chip manufacturing method involving a substrate with a conductive member, insulation, thermal-plastic material, and solder bump layers, allowing for the formation of conductive connections and jointed structures between chips, enabling efficient integration of different functions into a single package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If chips of different functions are integrated into one package using existing SOP technology, then the electronic apparatus can be lighter and smaller, but the existing methods do not effectively address the integration challenges and connection reliability
Solution Approach 1:
The chip structure is segmented into distinct functional layers: substrate, insulation layer, thermal-plastic material layer, conductive layer, and solder bump material layer. Each layer performs a specific function, allowing for modular integration of different chip functions while maintaining connection reliability through standardized interfacial structures.
Solution Approach 2:
The invention employs composite material structures combining substrate materials, insulation materials, thermal-plastic materials, conductive materials, and solder bump materials. This multi-material composite approach enables simultaneous achievement of mechanical strength, thermal management, electrical conductivity, and reliable inter-chip connections in a compact package.
2Ease of manufacture
If conventional chip connection methods are used, then the manufacturing process is simpler, but the resulting structures cannot achieve effective integration of diverse functions in a compact form
Solution Approach 1:
The conductive layer and solder bump material are pre-formed on the substrate during the manufacturing process, before chip assembly. This preliminary action enables subsequent easy alignment and bonding of chips to the substrate, achieving both manufacturing simplicity and effective integration of diverse functions through pre-configured connection structures.
Solution Approach 2:
The substrate structure with integrated conductive layers and solder bumps serves multiple functions: mechanical support, electrical connection, thermal management, and alignment reference. This universal structure enables integration of diverse chip functions while maintaining ease of manufacture through a standardized multi-layer platform.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of compact, integrated chip structures that facilitate the integration of diverse functions, resulting in lighter and smaller electronic devices by forming conductive connections and jointed structures between chips using solder bumps and thermal-plastic materials.
Implementation Method 1
a thermal-plastic material layer is formed on the insulation layer
Implementation Method 2
a solder bump material is also formed in the first opening and the second opening
Data Source
AI summary
The present invention provides a chip and its manufacturing methods and applications. Regarding the chip, there are several solder bumps on the backside of the chip. The difference of the invented chip from the convention chips is that the solder bumps are embedded in an insulting layer and a thermal-plastic material layer of the invented chip backside and separated by a conductive layer from the insulting layer and thermal-plastic material layer. Additionally, there are some end members in the insulting layer, and the end member corresponds to one solder bump. Through the present invention, chips with different functions can be integrated together, so that the needs for having portable communication devices lighter and smaller would be met.