Embedded SSD Controller Stacked Architecture for Storage Density
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Solution Overview
Problem
Current solid state disk (SSD) technologies face challenges in reducing manufacturing costs and increasing storage density while maintaining high performance and reliability, particularly in embedded SSDs where space and power efficiency are critical.
Innovation Solution
The development of a solid state disk with a stacked structure incorporating an internal SSD controller and nonvolatile memory, which includes external nonvolatile memory interfaces and channels, allowing for efficient control and connection of external memory devices, and optionally featuring a decoupling capacitor and voltage regulator to enhance performance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a traditional SSD controller architecture is used, then the device can be manufactured with existing processes, but the storage density and manufacturing cost efficiency are limited
Solution Approach 1:
The patent merges the controller and non-volatile memory into a single integrated package, eliminating the need for separate controller packages and reducing overall device complexity while increasing storage density through closer integration of components
Solution Approach 2:
The patent implements a nested structure where the controller is integrated within the same package as the non-volatile memory, with the controller positioned to directly interface with memory channels, creating a compact hierarchical arrangement that reduces footprint and improves density
2Quantity of substance
If more non-volatile memory devices are integrated, then storage capacity increases, but the device area and power consumption increase
Solution Approach 1:
The patent transitions from a planar arrangement of memory devices to a three-dimensional stacked architecture, allowing multiple memory layers to be integrated vertically within the same footprint, thereby increasing storage capacity without proportionally increasing device area
Solution Approach 2:
By integrating the controller and memory devices into a single package with shared power and signal routing, the patent reduces the total area required compared to separate packages, enabling higher storage capacity in a compact form factor
3Adaptability or versatility
If external memory interfaces are added, then adaptability and external storage capability improve, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent designs the controller with universal external memory interfaces that can accommodate different types and numbers of non-volatile memory devices, allowing the same controller package to serve multiple storage configurations and applications without requiring custom manufacturing for each variant
Solution Approach 2:
The patent segments the memory interface into multiple independent channels that can be selectively activated, allowing the controller to interface with varying numbers and types of external memory devices through a standardized architecture, thereby improving adaptability while maintaining manufacturing consistency
4Ease of manufacture
If a compact integrated structure is used, then manufacturing cost and area are reduced, but heat dissipation and power management become more challenging
Solution Approach 1:
The patent introduces dedicated power management circuits and decoupling capacitors as intermediary elements between the power supply and the integrated memory devices, providing localized power regulation and heat dissipation pathways that prevent thermal accumulation in the compact integrated structure
Solution Approach 2:
The patent implements local power management and decoupling capacitors positioned adjacent to specific memory blocks, providing targeted thermal management and power stabilization in different regions of the integrated package, allowing efficient heat dissipation without compromising the compact overall structure
Data Source
AI summary
A Solid State Disk (SSD) includes a plurality of nonvolatile memory devices storing data, and an embedded solid state disk controlling the plurality of nonvolatile memory devices. The SSD uses an embedded SSD (eSSD) as a controller. Thus, the SSD can be embodied in a small area. Also, since the SSD does not need an additional process for manufacturing a controller, manufacturing cost per unit may be reduced.