Embedded Substrate Adhesion Layer via Conductor Stress
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Solution Overview
Problem
The reliability of electrical connections between second terminals and via conductors in electronic component embedded substrates is compromised due to insufficient adhesion, which can lead to connection damage from internal stress and external forces.
Innovation Solution
An adhesion layer with higher adhesion strength than the second terminal-insulating layer interface is introduced, contacting the second terminal's end face, enhancing the adhesion between the adhesion layer and the insulating layer, and optionally between the adhesion layer and the via conductor, to improve the stability of the electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the second terminal and via conductor are formed of the same material, then manufacturing is simplified, but adhesion strength between the second terminal and insulating layer is insufficient
Solution Approach 1:
An adhesion layer is introduced as an intermediary between the second terminal and the insulating layer. This adhesion layer has higher adhesion strength to both the second terminal and the insulating layer, preventing the adhesion from breaking under internal stress and external forces, while allowing the second terminal and via conductor to be formed of the same material for manufacturing simplicity.
2Ease of manufacture
If adhesion strength between second terminal and insulating layer is insufficient, then manufacturing is easier, but connection reliability is reduced
Solution Approach 1:
The adhesion layer serves as a mediator that enhances connection reliability by providing stronger adhesion between the second terminal and insulating layer. This prevents connection damage from internal stress and external forces, while maintaining ease of manufacture as the adhesion layer can be integrated into existing manufacturing processes.
3Device complexity
If no adhesion layer is provided, then device complexity is reduced, but stress concentration on via conductor increases
Solution Approach 1:
The adhesion layer acts as a stress-distributing intermediary between the second terminal and insulating layer. By providing higher adhesion strength, it prevents stress concentration on the via conductor while adding minimal structural complexity, as the adhesion layer can be implemented as a thin film or coating.
Data Source
AI summary
An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.