Embedded Substrate Area Calculation Using Component and Thermal Data
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Solution Overview
Problem
In designing electronic component embedded substrates, particularly those with embedded power semiconductor elements, existing methods fail to accurately determine the required surface area, as they do not adequately consider factors like terminal settings, through holes, and thermal influences.
Innovation Solution
A design support apparatus and method that acquires component information and calculates the required minimum area of a component embedded substrate, taking into account the size of each electronic component, terminal information, through holes, and thermal factors, using units such as a component information acquiring unit and a required minimum area calculating unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing methods are used to determine surface area, then the calculation is simple, but the accuracy is insufficient because terminal settings, through holes, and thermal influences are not considered
Solution Approach 1:
The design support apparatus divides the surface area calculation into multiple independent calculation units: a first calculation unit that calculates area based on component size, a second calculation unit that calculates area based on terminal settings, and a third calculation unit that calculates area based on through holes. Each unit processes specific factors separately, then the results are combined to produce the total required surface area. This segmentation allows accurate consideration of multiple factors while maintaining manageable system complexity.
Solution Approach 2:
The apparatus performs preliminary calculations for each factor (component size, terminal settings, through holes) independently before integrating them into the final surface area determination. By preparing and storing intermediate calculation results, the system can efficiently combine these pre-computed values to arrive at the accurate total surface area, avoiding the need for complex real-time integration of all factors.
2Manufacturing precision
If multiple factors are considered in surface area calculation, then the design accuracy improves, but the calculation complexity increases
Solution Approach 1:
The calculation process is segmented into distinct modules, each handling a specific factor (component dimensions, terminal configurations, through hole requirements). This modular approach allows each factor to be calculated independently using appropriate methods, then the results are summed to produce the total required surface area, reducing overall computational complexity while maintaining comprehensive accuracy.
Solution Approach 2:
The system changes the approach from a single complex calculation to multiple simpler parameter-based calculations. Each factor is converted into a specific parameter (component area, terminal area, through hole area) that can be calculated independently using standard geometric formulas, then these parameters are aggregated to produce the final design accuracy requirement.
Data Source
AI summary
Provided a design support apparatus of supporting design of a component embedded substrate including one or more embedded electronic components that configure at least a part of a circuit, including, a component information acquiring unit that acquires component information about the electronic components to be incorporated in the component embedded substrate; and a required minimum area calculating unit that calculates a required minimum area of a surface of the component embedded substrate on the basis of at least information about a size of each electronic component contained in the component information.