Embedded Substrate Core Layer Cavities Heat Dissipation Warpage
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Solution Overview
Problem
Electronic component embedded substrates face challenges with heat dissipation and warpage due to the miniaturization and thinning of electronic devices, which limit the number of components that can be mounted on printed circuit boards and compromise structural stability.
Innovation Solution
An electronic component embedded substrate design featuring a core layer with cavities on both surfaces, where electronic components are embedded in one cavity and a built-in block is placed in the opposite cavity, covered with insulating materials and connected via conductive vias to improve heat dissipation and structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are embedded in the printed circuit board to increase component density, then the number of mountable components increases, but heat dissipation becomes more difficult and warpage increases
Solution Approach 1:
The patent transitions from surface mounting to three-dimensional embedding of electronic components within the core layer. By creating cavities in the core layer and placing components inside, the design utilizes the vertical dimension (thickness direction) to increase component density without expanding the board's surface area, thereby addressing heat dissipation challenges associated with traditional surface mounting
2Productivity
If electronic components are embedded in the printed circuit board to increase component density, then the number of mountable components increases, but structural stability deteriorates due to warpage
Solution Approach 1:
The patent introduces a built-in block with asymmetric configuration to counterbalance the asymmetry created by embedded electronic components. The built-in block is positioned and dimensioned to compensate for the imbalance in the core layer, thereby reducing warpage and improving structural stability while maintaining high component density
3Volume of moving object
If the printed circuit board is miniaturized and thinned to meet device requirements, then device size decreases, but the number of mountable components is limited
Solution Approach 1:
The patent resolves the contradiction between miniaturization and component density by utilizing the thickness dimension of the core layer. By embedding components within the core layer's volume rather than only on its surface, the design achieves high component density in a compact form factor, enabling more components to be mounted without increasing the overall device size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and reduces warpage by allowing for efficient heat transfer through thermally conductive materials and improves structural stability by balancing the asymmetry of components on the substrate.
Implementation Method 1
improve heat dissipation characteristics... efficient heat transfer through thermally conductive materials
Data Source
AI summary
An electronic component embedded substrate includes a core layer having a first cavity and a second cavity on a first surface and a second surface of the core layer, respectively, the second surface opposite to the first surface in a thickness direction of the core layer; an electronic component disposed in the first cavity; a first insulating material covering at least a portion of the electronic component; a first wiring layer disposed on the first insulating material and connected to the electronic component; a built-in block disposed in the second cavity; and a second insulating material covering at least a portion of the built-in block.