Electronic Component-Embedded Substrate with Cavity and Dam Structure
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Solution Overview
Problem
The challenge in developing electronic component-embedded substrates is to reduce thickness while ensuring efficient heat dissipation and maintaining circuit complexity, especially when embedding multiple dies, as existing technologies face difficulties in forming thin substrates with effective heat dissipation and complex circuit interconnections.
Innovation Solution
The proposed solution involves creating a substrate with a cavity structure where an electronic component is mounted face-up, using a dam structure with a through-portion and filling it with an insulating material of excellent flow properties, allowing for a reduced number of wiring layers and enabling efficient heat dissipation through a metal layer, while simplifying circuit connections using a microcircuit process like Photo Imageable Dielectric (PID) or Ajinomoto Build-up Film (ABF).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If electronic components are embedded in a printed circuit board using conventional methods, then the substrate can accommodate electronic components, but the substrate thickness cannot be reduced sufficiently
Solution Approach 1:
The patent embeds electronic components within cavities formed in the substrate layers, nesting the components inside the substrate structure itself. This allows the substrate to accommodate components while maintaining a compact, thin profile, as the components are integrated within the substrate thickness rather than adding external volume.
Solution Approach 2:
The patent transitions from conventional surface-mounted or through-hole component arrangements to a three-dimensional embedded configuration. By forming cavities that penetrate through multiple substrate layers and positioning components within these cavities, the design utilizes the vertical dimension to reduce overall substrate thickness while maintaining component functionality.
2Length of moving object
If the substrate thickness is reduced, then the device becomes thinner, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces thermal interface materials and thermally conductive filling materials as intermediaries between the electronic components and the substrate. These materials facilitate efficient heat transfer from the embedded components through the substrate thickness, enabling effective heat dissipation even in a thin substrate configuration.
Solution Approach 2:
The patent employs composite materials with high thermal conductivity for the filling materials and thermal interface layers. These composite materials combine electrical insulation properties with superior thermal conduction, allowing the thin substrate to maintain both electrical functionality and effective heat dissipation pathways.
3Adaptability or versatility
If multiple dies are embedded in the substrate, then circuit functionality is enhanced, but circuit complexity and interconnection difficulty increase
Solution Approach 1:
The patent divides the circuit functionality into multiple separate dies, each performing specific functions. These segmented dies are embedded at different locations and depths within the substrate, allowing independent optimization of each die while the substrate provides integrated interconnection pathways through conductive vias and traces.
Solution Approach 2:
The patent applies different material properties and structural configurations to different regions of the substrate. Specific areas contain embedded dies with localized interconnection structures, while other regions provide routing pathways and thermal management. This local differentiation simplifies the overall interconnection complexity by organizing functions in specialized zones.
Data Source
AI summary
An electronic component-embedded substrate includes a wiring structure including a plurality of insulating layers and a plurality of wiring layers and having a cavity penetrating through at least one of the plurality of insulating layers, a first electronic component disposed in the cavity, a dam structure disposed on the wiring structure and having a through-portion, a first insulating material disposed in at least a portion of each of the cavity and the through-portion, and covering at least a portion of each of the wiring structure and the first electronic component, and a first circuit layer disposed on the first insulating material.