Embedded Interconnect Substrate Cooling for High-Density Die Links
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Solution Overview
Problem
High-density signal lines on embedded substrates lead to excessive heat accumulation, affecting signal transmission quality.
Innovation Solution
Incorporating a heat sink at the bottom of an interconnect substrate and a second heat sink above the dies, along with a stiffener ring and thermal conductive materials, to facilitate efficient heat dissipation from both the top and bottom of the dies, while maintaining high-density interconnectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-density signal lines are arranged on the embedded substrate to achieve high-density interconnection, then the interconnection density is improved, but heat accumulation increases which deteriorates signal transmission quality
Solution Approach 1:
The patent introduces heat dissipation holes that extend vertically through the embedded substrate, adding a third-dimensional heat dissipation pathway. This allows heat to be conducted from the signal lines through the substrate thickness to heat dissipation structures at the bottom surface, effectively managing thermal accumulation while maintaining high-density interconnection on the signal transmission surface.
Solution Approach 2:
The patent introduces heat dissipation holes as intermediary structures that facilitate thermal energy transfer from the high-density signal lines through the embedded substrate to external heat dissipation components. These holes act as thermal conduits, enabling efficient heat removal without interfering with the electrical signal transmission function.
2Temperature
If heat dissipation structures are added to reduce temperature, then thermal dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The embedded substrate serves multiple functions: it provides mechanical support for the dies, establishes electrical interconnections through signal lines, and conducts heat away from the signal lines through integrated heat dissipation holes. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent merges the heat dissipation function directly into the embedded substrate structure by forming heat dissipation holes within the substrate material itself. This integration combines the substrate's structural and thermal management functions into a single component, avoiding the need for separate heat sinks or thermal management assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal dissipation efficiency, stabilizes die performance by reducing temperature, and improves signal transmission quality and bandwidth.
Implementation Method 1
a heat sink at the bottom of the interconnect substrate
Implementation Method 2
thermal conductive materials, to facilitate efficient heat dissipation
Data Source
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AI summary
Embodiments of the present disclosure provide an electronic packaging, a manufacturing method for an electronic packaging and an electronic apparatus. The electronic packaging includes a package substrate and an interconnect substrate, wherein a first surface of the package substrate is provided with a recess in which the interconnect substrate is embedded; and a bottom of the interconnect substrate is provided with a first heat sink; the first surface of the package substrate is provided with a first die and a second die; the first die and the second die are electrically connected through the interconnect substrate. Embodiments of the present disclosure are suitable for application scenarios that improve the quality of signal transmission between dies.