Embedded Component Substrate Structure With Fewer Layers
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Solution Overview
Problem
The challenge in developing thinner electronic devices is the need for separate adhesive films and metal patterns for electronic components, which limits thinning and increases the number of unnecessary layers, affecting signal transmission and component attachment.
Innovation Solution
A substrate with an embedded electronic component is designed using an encapsulant without a separate adhesive film, incorporating a build-up structure with tapered via layers and a backside wiring layer directly attached to the encapsulant, reducing the number of layers and enabling thinner designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a separate adhesive film is used to attach the electronic component to the metal pattern, then the component attachment is reliable, but the substrate thickness increases and thinning is limited
Solution Approach 1:
The patent merges the adhesive film function into the encapsulant layer. The encapsulant serves dual purposes: protecting the electronic component and providing adhesion to the metal pattern, eliminating the need for a separate adhesive film and reducing overall substrate thickness.
Solution Approach 2:
The encapsulant is designed to perform multiple functions simultaneously: mechanical protection of the electronic component, adhesion to the metal pattern, and structural support. This multi-functionality eliminates the need for separate adhesive layers.
2Reliability
If a backside wiring layer is added for signal transmission, then signal transmission capability is improved, but the number of layers increases and device complexity increases
Solution Approach 1:
The patent combines the backside wiring layer with the metal pattern that serves as a stopper for cavity processing. This integration allows the metal pattern to fulfill multiple roles: structural support, signal transmission, and processing guide, thereby reducing the total number of layers.
Solution Approach 2:
The metal pattern on the rear surface is designed to serve multiple functions: acting as a stopper during cavity processing, providing structural support, and enabling signal transmission. This multi-functionality reduces the need for separate dedicated layers.
3Reliability
If additional layers are added for component attachment and signal transmission, then functional requirements are met, but the area ratio of the electronic component decreases and warpage increases
Solution Approach 1:
The patent merges multiple functional layers into fewer integrated structures. The encapsulant combines protection and adhesion functions, while the metal pattern integrates structural and signaling roles, thereby maximizing the electronic component's area ratio while meeting all functional requirements.
Solution Approach 2:
The patent extracts and eliminates unnecessary intermediate layers from the traditional multi-layer structure. By removing redundant adhesive films and separate backside wiring layers, the design achieves functional requirements with fewer layers, increasing the electronic component's area ratio and reducing warpage.
Data Source
AI summary
A substrate with an electronic component embedded therein includes: a core layer having a through-portion; an electronic component disposed in the through-portion; an encapsulant disposed on a lower surface of the core layer, disposed in at least a portion of the through-portion, and covering at least a portion of a lower surface of the electronic component; and a build-up structure disposed on an upper surface of the core layer, and including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers.