Embedded Substrate Film Layout for Semiconductor Z-Height Relief
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in balancing z-height and efficiency due to the use of film over dies (FODs), which occupy space, increase the risk of die cracking, and cause delamination and mold voids.
Innovation Solution
The implementation of embedded films in substrates (FIS) within the package substrate cavities, which reduces the z-height by eliminating the need for an adhesive layer between stacked dies and spacers, thereby allowing thicker dies and minimizing the risk of cracking and mold-related issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If film over dies (FODs) are used to facilitate unbalanced z-height under the bottommost stacked die, then the z-height constraint is addressed, but the overall package space increases and other dies must be made thinner which increases the risk of die cracking
Solution Approach 1:
The patent transitions from placing adhesive films on the surface (FOD approach) to embedding films within substrate cavities (FIS approach). This dimensional relocation allows the adhesive function to be achieved without occupying additional z-height space above the dies, thereby eliminating the need to thin the dies and reducing cracking risk while still addressing z-height unbalance.
Solution Approach 2:
The adhesive films are nested within pre-formed cavities in the substrate, rather than being placed as separate layers above the dies. This nesting approach integrates the adhesive function into the substrate structure itself, eliminating the need for additional space and avoiding the need to reduce die thickness.
2Adaptability or versatility
If film over dies (FODs) are used to address z-height unbalance, then the packaging flexibility is improved, but uncured FODs can potentially drop and induce delamination and mold voids
Solution Approach 1:
The substrate cavities are pre-formed before the adhesive films are placed, and the films are embedded within these cavities before the molding process. This preliminary structuring ensures that uncured adhesive material is contained and supported, preventing it from dropping and causing delamination or mold voids while maintaining packaging flexibility.
Solution Approach 2:
The substrate cavities act as an intermediary structure that contains and supports the adhesive films during the packaging process. This intermediary containment prevents the uncured FOD material from moving freely and causing harmful effects like delamination and mold voids, while still allowing the adhesive to perform its function.
3Strength
If adhesive layers are used between stacked dies and spacers, then the structural support is provided, but the overall z-height increases
Solution Approach 1:
The patent merges the adhesive layer function with the substrate structure by embedding films within substrate cavities. This combination eliminates the need for separate adhesive layers between stacked dies and spacers, providing the same structural support function while reducing the overall z-height of the package.
Data Source
AI summary
Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a package substrate with a plurality of cavities, and a plurality of adhesives in the cavities of the package substrate. The semiconductor package also includes a plurality of stacked dies over the adhesives and the package substrate, where the stacked dies are coupled to the adhesives with spacers. The spacers may be positioned below outer edges of the stacked dies. The adhesives may include a plurality of films. The semiconductor package may further include a plurality of interconnects coupled to the stacked dies and package substrate, a plurality of electrical components on the package substrate, a mold layer over the stacked dies, interconnects, spacers, adhesives, and electrical components, and a plurality of adhesive layers coupled to the plurality of stacked dies, where one of the adhesive layers couples the stacked dies to the spacers.