Embedded Interconnect Substrate Packaging With Heat Sink Cooling
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Solution Overview
Problem
High-density signal lines on embedded substrates in electronic packaging lead to increased temperatures, which can impair signal transmission quality.
Innovation Solution
The electronic packaging design includes a package substrate with a recessed area for embedding an interconnect substrate, which is supported by a heat sink. This configuration enhances thermal dissipation and improves signal transmission quality between dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-density signal lines are arranged on the embedded interconnect substrate, then interconnection density between dies is improved, but temperature accumulation increases affecting signal transmission quality
Solution Approach 1:
A heat sink is introduced as an intermediary component between the interconnect substrate and the package substrate. The heat sink receives heat from the interconnect substrate through thermal conduction and dissipates it to the surrounding environment, thereby mediating the thermal management of the high-density signal lines without affecting their interconnection density
Solution Approach 2:
The heat dissipation function is extracted from the package substrate structure by adding a dedicated heat sink component. This allows the package substrate to focus on its primary function of mechanical support and electrical interconnection, while the heat sink专门 handles thermal management of the interconnect substrate
2Temperature
If a heat sink is added to the embedded substrate structure, then thermal dissipation is improved, but device complexity increases
Solution Approach 1:
The heat sink is merged with the package substrate assembly as an integrated component. The heat sink is positioned to contact the interconnect substrate and is structurally combined with the package substrate, creating a unified assembly that achieves thermal management without requiring separate complex support structures
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the interconnect substrate, establishes electrical connections between dies, and when combined with the heat sink, performs thermal management. This multi-functionality reduces the need for additional dedicated components and simplifies the overall device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces temperature buildup in the interconnect substrate, thereby stabilizing the performance of dies and improving the quality of signal transmission.
Implementation Method 1
a bottom of the interconnect substrate is provided with a first heat sink
Data Source
AI summary
Embodiments of the present disclosure provide an electronic packaging, a manufacturing method for an electronic packaging and an electronic apparatus. The electronic packaging includes a package substrate and an interconnect substrate, wherein a first surface of the package substrate is provided with a recess in which the interconnect substrate is embedded; and a bottom of the interconnect substrate is provided with a first heat sink; the first surface of the package substrate is provided with a first die and a second die; the first die and the second die are electrically connected through the interconnect substrate.